Richard L. Simmons

Person

Jonestown, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
High force compression flip chip bonding system
- Patent number 5,462,217
- Issue date Oct 31, 1995
- Microelectronics and Computer Technology Corporation
- Richard L. Simmons
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High force compression flip chip bonding method and system
- Patent number 5,368,217
- Issue date Nov 29, 1994
- Microelectronics and Computer Technology Corporation
- Richard L. Simmons
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for forming metal leads
- Patent number 5,283,946
- Issue date Feb 8, 1994
- Microelectronics and Computer Technology Corporation
- Richard L. Simmons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for the excise and lead form of TAB devices
- Patent number 5,210,936
- Issue date May 18, 1993
- Microelectronics and Computer Technology Corporation
- Richard L. Simmons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tab tape singulation apparatus and method
- Patent number 5,134,912
- Issue date Aug 4, 1992
- Microelectronics and Computer Technology Corporation
- Richard L. Simmons
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Laser Bonding apparatus and method
- Patent number 4,845,335
- Issue date Jul 4, 1989
- Microelectronics and Computer Technology Corporation
- Daniel M. Andrews
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Richard L. Simmons

Person

Patents Grantslast 30 patents

High force compression flip chip bonding system

High force compression flip chip bonding method and system

Method and apparatus for forming metal leads

Method and apparatus for the excise and lead form of TAB devices

Tab tape singulation apparatus and method

Laser Bonding apparatus and method