Richard Langlois

Person

Quebec, CA

People

Patents Grantslast 30 patents

Information Patent Grant
High-density chip-to-chip interconnection with silicon bridge
- Patent number 10,784,202
- Issue date Sep 22, 2020
- International Business Machines Corporation
- Francois Arguin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gallium liquid metal embrittlement for device rework
- Patent number 10,679,966
- Issue date Jun 9, 2020
- International Business Machines Corporation
- David Danovitch
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Gallium liquid metal embrittlement for device rework
- Patent number 10,559,549
- Issue date Feb 11, 2020
- International Business Machines Corporation
- David Danovitch
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Nanofiller in an optical interface
- Patent number 10,338,325
- Issue date Jul 2, 2019
- International Business Machines Corporation
- Barnim Alexander Janta-Polczynski
- G02 - OPTICS
Information Patent Grant
Optical interconnect attach to photonic device with partitioning ad...
- Patent number 10,302,869
- Issue date May 28, 2019
- International Business Machines Corporation
- Barnim Alexander Janta-Polczynski
- G02 - OPTICS
Information Patent Grant
Optical interconnect attach to photonic device with partitioning ad...
- Patent number 10,295,749
- Issue date May 21, 2019
- International Business Machines Corporation
- Barnim Alexander Janta-Polczynski
- G02 - OPTICS
Information Patent Grant
Flip chip assembly with connected component
- Patent number 10,211,174
- Issue date Feb 19, 2019
- International Business Machines Corporation
- Jean Audet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip assembly with connected component
- Patent number 9,984,988
- Issue date May 29, 2018
- International Business Machines Corporation
- Jean Audet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip assembly with connected component
- Patent number 9,553,079
- Issue date Jan 24, 2017
- International Business Machines Corporation
- Jean Audet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliability enhancement of metal thermal interface
- Patent number 8,232,636
- Issue date Jul 31, 2012
- International Business Machines Corporation
- James N Humenik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for electrical commoning of circuits
- Patent number 7,038,462
- Issue date May 2, 2006
- International Business Machines Corporation
- David Danovitch
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
HIGH-DENSITY CHIP-TO-CHIP INTERCONNECTION WITH SILICON BRIDGE
- Publication number 20190172787
- Publication date Jun 6, 2019
- International Business Machines Corporation
- Francois Arguin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GALLIUM LIQUID METAL EMBRITTLEMENT FOR DEVICE REWORK
- Publication number 20180233482
- Publication date Aug 16, 2018
- International Business Machines Corporation
- David Danovitch
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
GALLIUM LIQUID METAL EMBRITTLEMENT FOR DEVICE REWORK
- Publication number 20180233483
- Publication date Aug 16, 2018
- International Business Machines Corporation
- David Danovitch
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP CHIP ASSEMBLY WITH CONNECTED COMPONENT
- Publication number 20170170133
- Publication date Jun 15, 2017
- International Business Machines Corporation
- JEAN AUDET
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP ASSEMBLY WITH CONNECTED COMPONENT
- Publication number 20170170134
- Publication date Jun 15, 2017
- International Business Machines Corporation
- JEAN AUDET
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABILITY ENHANCEMENT OF METAL THERMAL INTERFACE
- Publication number 20110180923
- Publication date Jul 28, 2011
- International Business Machines Corporation
- JAMES N. HUMENIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR ELECTRICAL COMMONING OF CIRCUITS
- Publication number 20050062493
- Publication date Mar 24, 2005
- International Business Machines Corporation
- David Danovitch
- G01 - MEASURING TESTING

Richard Langlois

Person

Patents Grantslast 30 patents

High-density chip-to-chip interconnection with silicon bridge

Gallium liquid metal embrittlement for device rework

Gallium liquid metal embrittlement for device rework

Nanofiller in an optical interface

Optical interconnect attach to photonic device with partitioning ad...

Optical interconnect attach to photonic device with partitioning ad...

Flip chip assembly with connected component

Flip chip assembly with connected component

Flip chip assembly with connected component

Reliability enhancement of metal thermal interface

Method and apparatus for electrical commoning of circuits

Patents Applicationslast 30 patents

HIGH-DENSITY CHIP-TO-CHIP INTERCONNECTION WITH SILICON BRIDGE

GALLIUM LIQUID METAL EMBRITTLEMENT FOR DEVICE REWORK

GALLIUM LIQUID METAL EMBRITTLEMENT FOR DEVICE REWORK

FLIP CHIP ASSEMBLY WITH CONNECTED COMPONENT

FLIP CHIP ASSEMBLY WITH CONNECTED COMPONENT

RELIABILITY ENHANCEMENT OF METAL THERMAL INTERFACE

METHOD AND APPARATUS FOR ELECTRICAL COMMONING OF CIRCUITS