Richard Lee Carlson

Follow

Person

Ben Lomond, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Direct thermal compression bonding through a multiconductor base layer
- Patent number 6,446,335
- Issue date Sep 10, 2002
- International Business Machines Corporation
- Richard Lee Carlson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiconductor bonded connection assembly with direct thermal compr...
- Patent number 6,093,894
- Issue date Jul 25, 2000
- International Business Machines Corporation
- Richard Lee Carlson
- H01 - BASIC ELECTRIC ELEMENTS