Richard Lee Mangold

Person

Lake Worth, FL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Solder printing apparatus
- Patent number 6,352,025
- Issue date Mar 5, 2002
- Motorola, Inc.
- Ovidiu Neiconi
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Assembly with dual purpose connector
- Patent number 6,224,393
- Issue date May 1, 2001
- Motorola, Inc.
- Eric Joseph Faragi
- G02 - OPTICS
Information Patent Grant
Apparatus for indexing and affixing components to a substrate
- Patent number 6,008,476
- Issue date Dec 28, 1999
- Motorola, Inc.
- Ovidiu Neiconi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for marking functional integrated circuit chips with underfi...
- Patent number 5,918,363
- Issue date Jul 6, 1999
- Motorola, Inc.
- Reed Allen George
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for affixing components to a substrate when a...
- Patent number 5,916,513
- Issue date Jun 29, 1999
- Motorola
- Richard Lee Mangold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating a solder bump for a flip chip integrated ci...
- Patent number 5,759,910
- Issue date Jun 2, 1998
- Motorola, Inc.
- Rick Lee Mangold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid phase conformal coating suitable for use with electronic devices
- Patent number 5,475,379
- Issue date Dec 12, 1995
- Motorola, Inc.
- Reed A. George
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for selectively applying solder paste to multiple types o...
- Patent number 5,452,656
- Issue date Sep 26, 1995
- Motorola, Inc.
- Christopher L. Becher
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method and apparatus for selectively applying solder paste to multi...
- Patent number 5,436,028
- Issue date Jul 25, 1995
- Motorola, Inc.
- Christopher L. Becher
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method for underencapsulating components on circuit supporting subs...
- Patent number 5,386,624
- Issue date Feb 7, 1995
- Motorola, Inc.
- Reed A. George
- H01 - BASIC ELECTRIC ELEMENTS

Richard Lee Mangold

Person

Patents Grantslast 30 patents

Solder printing apparatus

Assembly with dual purpose connector

Apparatus for indexing and affixing components to a substrate

Method for marking functional integrated circuit chips with underfi...

Method and apparatus for affixing components to a substrate when a...

Process for fabricating a solder bump for a flip chip integrated ci...

Solid phase conformal coating suitable for use with electronic devices

Apparatus for selectively applying solder paste to multiple types o...

Method and apparatus for selectively applying solder paste to multi...

Method for underencapsulating components on circuit supporting subs...