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Richard M. Goeden
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Goleta, CA, US
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Patents Grants
last 30 patents
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Patent Grant
Wafer level packaging of microbolometer vacuum package assemblies
Patent number
10,553,454
Issue date
Feb 4, 2020
FLIR Systems, Inc.
Paul Schweikert
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Wafer level packaging of microbolometer vacuum package assemblies
Patent number
9,741,591
Issue date
Aug 22, 2017
FLIR Systems, Inc.
Paul Schweikert
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Boresight alignment station
Patent number
8,860,800
Issue date
Oct 14, 2014
FLIR Systems, Inc.
Marco A. Scussat
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Sensor calibration systems and methods for infrared cameras
Patent number
8,378,290
Issue date
Feb 19, 2013
FLIR Systems, Inc.
George Speake
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Calibration systems and methods for infrared cameras
Patent number
8,049,163
Issue date
Nov 1, 2011
FLIR Systems, Inc.
Russell Granneman
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Motorized leveling stages
Patent number
7,810,251
Issue date
Oct 12, 2010
FLIR Systems, Inc.
Richard M. Goeden
G01 - MEASURING TESTING
Patents Applications
last 30 patents
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Patent Application
WAFER LEVEL PACKAGING OF MICROBOLOMETER VACUUM PACKAGE ASSEMBLIES
Publication number
20170372920
Publication date
Dec 28, 2017
FLIR SYSTEMS, INC.
Paul Schweikert
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
WAFER LEVEL PACKAGING OF MICROBOLOMETER VACUUM PACKAGE ASSEMBLIES
Publication number
20140186999
Publication date
Jul 3, 2014
FLIR SYSTEMS, INC.
Paul Schweikert
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
BORESIGHT ALIGNMENT STATION
Publication number
20120249863
Publication date
Oct 4, 2012
FLIR SYSTEMS, INC.
Marco A. Scussat
H04 - ELECTRIC COMMUNICATION TECHNIQUE