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Richard M. Ramirez
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Freemont, CA, US
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last 30 patents
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Patent Grant
Semiconductor package ejector
Patent number
6,490,167
Issue date
Dec 3, 2002
Intel Corporation
Michael Philip Brownell
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Emulative lid/heatspreader for processor die attached to an organic...
Patent number
5,903,436
Issue date
May 11, 1999
Intel Corporation
Michael P. Brownell
H01 - BASIC ELECTRIC ELEMENTS