Richard Phillips

Person

Tualatin, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Pedestals for modulating film properties in atomic layer deposition...
- Patent number 12,110,586
- Issue date Oct 8, 2024
- Lam Research Corporation
- Adrien Lavoie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Thickness compensation by modulation of number of deposition cycles...
- Patent number 11,286,560
- Issue date Mar 29, 2022
- Lam Research Corporation
- Richard Phillips
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Substrate processing chamber including conical surface for reducing...
- Patent number 10,840,061
- Issue date Nov 17, 2020
- Lam Research Corporation
- Richard Phillips
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Thickness compensation by modulation of number of deposition cycles...
- Patent number 10,697,059
- Issue date Jun 30, 2020
- Lam Research Corporation
- Richard Phillips
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Dielectric gapfill of high aspect ratio features utilizing a sacrif...
- Patent number 10,658,172
- Issue date May 19, 2020
- Lam Research Corporation
- Joseph R. Abel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doped ALD films for semiconductor patterning applications
- Patent number 10,629,435
- Issue date Apr 21, 2020
- Lam Research Corporation
- Shankar Swaminathan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and apparatuses for increasing reactor processing batch size
- Patent number 10,431,451
- Issue date Oct 1, 2019
- Lam Research Corporation
- Pulkit Agarwal
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Collar, conical showerheads and/or top plates for reducing recircul...
- Patent number 10,403,474
- Issue date Sep 3, 2019
- Lam Research Corporation
- Richard Phillips
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Dielectric gapfill of high aspect ratio features utilizing a sacrif...
- Patent number 10,269,559
- Issue date Apr 23, 2019
- Lam Research Corporation
- Joseph Abel
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INDEPENDENTLY ADJUSTABLE FLOWPATH CONDUCTANCE IN MULTI-STATION SEMI...
- Publication number 20220228263
- Publication date Jul 21, 2022
- LAM RESEARCH CORPORATION
- Michael Philip Roberts
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PEDESTALS FOR MODULATING FILM PROPERTIES IN ATOMIC LAYER DEPOSITION...
- Publication number 20220162749
- Publication date May 26, 2022
- LAM RESEARCH CORPORATION
- Adrien LAVOIE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
THICKNESS COMPENSATION BY MODULATION OF NUMBER OF DEPOSITION CYCLES...
- Publication number 20200299838
- Publication date Sep 24, 2020
- LAM RESEARCH CORPORATION
- Richard Phillips
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING CHAMBER INCLUDING CONICAL SURFACE FOR REDUCING...
- Publication number 20190385817
- Publication date Dec 19, 2019
- LAM RESEARCH CORPORATION
- Richard Phillips
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DIELECTRIC GAPFILL OF HIGH ASPECT RATIO FEATURES UTILIZING A SACRIF...
- Publication number 20190206677
- Publication date Jul 4, 2019
- LAM RESEARCH CORPORATION
- Joseph R. Abel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THICKNESS COMPENSATION BY MODULATION OF NUMBER OF DEPOSITION CYCLES...
- Publication number 20190085448
- Publication date Mar 21, 2019
- LAM RESEARCH CORPORATION
- Richard Phillips
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DIELECTRIC GAPFILL OF HIGH ASPECT RATIO FEATURES UTILIZING A SACRIF...
- Publication number 20190080903
- Publication date Mar 14, 2019
- LAM RESEARCH CORPORATION
- Joseph Abel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUSES FOR INCREASING REACTOR PROCESSING BATCH SIZE
- Publication number 20180374697
- Publication date Dec 27, 2018
- LAM RESEARCH CORPORATION
- Pulkit Agarwal
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Wafer Edge Contact Hardware and Methods to Eliminate Deposition at...
- Publication number 20180334746
- Publication date Nov 22, 2018
- LAM RESEARCH CORPORATION
- Patrick Breiling
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DOPED ALD FILMS FOR SEMICONDUCTOR PATTERNING APPLICATIONS
- Publication number 20180033622
- Publication date Feb 1, 2018
- LAM RESEARCH CORPORATION
- Shankar Swaminathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLLAR, CONICAL SHOWERHEADS AND/OR TOP PLATES FOR REDUCING RECIRCUL...
- Publication number 20180012733
- Publication date Jan 11, 2018
- LAM RESEARCH CORPORATION
- Richard Phillips
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Richard Phillips

Person

Patents Grantslast 30 patents

Pedestals for modulating film properties in atomic layer deposition...

Thickness compensation by modulation of number of deposition cycles...

Substrate processing chamber including conical surface for reducing...

Thickness compensation by modulation of number of deposition cycles...

Dielectric gapfill of high aspect ratio features utilizing a sacrif...

Doped ALD films for semiconductor patterning applications

Methods and apparatuses for increasing reactor processing batch size

Collar, conical showerheads and/or top plates for reducing recircul...

Dielectric gapfill of high aspect ratio features utilizing a sacrif...

Patents Applicationslast 30 patents

INDEPENDENTLY ADJUSTABLE FLOWPATH CONDUCTANCE IN MULTI-STATION SEMI...

PEDESTALS FOR MODULATING FILM PROPERTIES IN ATOMIC LAYER DEPOSITION...

THICKNESS COMPENSATION BY MODULATION OF NUMBER OF DEPOSITION CYCLES...

SUBSTRATE PROCESSING CHAMBER INCLUDING CONICAL SURFACE FOR REDUCING...

DIELECTRIC GAPFILL OF HIGH ASPECT RATIO FEATURES UTILIZING A SACRIF...

THICKNESS COMPENSATION BY MODULATION OF NUMBER OF DEPOSITION CYCLES...

DIELECTRIC GAPFILL OF HIGH ASPECT RATIO FEATURES UTILIZING A SACRIF...

METHODS AND APPARATUSES FOR INCREASING REACTOR PROCESSING BATCH SIZE

Wafer Edge Contact Hardware and Methods to Eliminate Deposition at...

DOPED ALD FILMS FOR SEMICONDUCTOR PATTERNING APPLICATIONS

COLLAR, CONICAL SHOWERHEADS AND/OR TOP PLATES FOR REDUCING RECIRCUL...