Richard Redburn

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Phoenix, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Solder bump interconnect
- Patent number 8,446,019
- Issue date May 21, 2013
- FlipChip International, LLC
- Reynante Alvarado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bump interconnect
- Patent number 8,188,606
- Issue date May 29, 2012
- FlipChip International, LLC
- Reynante Alvarado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bump interconnect for improved mechanical and thermo-mechani...
- Patent number 7,973,418
- Issue date Jul 5, 2011
- FlipChip International, LLC
- Reynante Alvarado
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SOLDER BUMP INTERCONNECT
- Publication number 20120228765
- Publication date Sep 13, 2012
- FlipChip International, LLC
- Reynante Alvarado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BUMP INTERCONNECT
- Publication number 20110186995
- Publication date Aug 4, 2011
- FlipChip International, LLC
- Reynante Alvarado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BUMP INTERCONNECT FOR IMPROVED MECHANICAL AND THERMO-MECHANI...
- Publication number 20080308934
- Publication date Dec 18, 2008
- FlipChip International, LLC
- Reynante Alvarado
- H01 - BASIC ELECTRIC ELEMENTS