Richard Regner

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Boise, ID, US

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Patents Grantslast 30 patents

Information Patent Grant
Printing stencils for electronic substrates
- Patent number 6,766,736
- Issue date Jul 27, 2004
- Micron Technology, Inc.
- Richard Regner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldered integrated circuit connections
- Patent number 6,391,468
- Issue date May 21, 2002
- Micron Technology, Inc.
- Richard Regner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldered integrated circuit connections
- Patent number 6,248,452
- Issue date Jun 19, 2001
- Micron Technology, Inc.
- Richard Regner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for depositing solder paste on a pad
- Patent number 6,094,832
- Issue date Aug 1, 2000
- Micron Technology, Inc.
- Richard Regner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldered integrated circuit connections
- Patent number 6,012,231
- Issue date Jan 11, 2000
- Micron Technology, Inc.
- Richard Regner
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Printing stencils for electronic substrates
- Publication number 20030041753
- Publication date Mar 6, 2003
- Richard Regner
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Soldered integrated circuit connections
- Publication number 20010011676
- Publication date Aug 9, 2001
- Richard Regner
- H01 - BASIC ELECTRIC ELEMENTS