Richard Te Gan

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Chandler, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Tie bar removal for semiconductor device packaging
- Patent number 11,967,507
- Issue date Apr 23, 2024
- NXP USA, INC.
- Richard Te Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tie bar removal for semiconductor device packaging
- Patent number 11,222,790
- Issue date Jan 11, 2022
- NXP USA, INC.
- Richard Te Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-via redistribution layer for integrated circuits having solde...
- Patent number 10,192,837
- Issue date Jan 29, 2019
- NXP B.V.
- Chung Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TIE BAR REMOVAL FOR SEMICONDUCTOR DEVICE PACKAGING
- Publication number 20220093416
- Publication date Mar 24, 2022
- NXP USA, Inc.
- Richard Te Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TIE BAR REMOVAL FOR SEMICONDUCTOR DEVICE PACKAGING
- Publication number 20210202267
- Publication date Jul 1, 2021
- NXP USA, Inc.
- Richard Te Gan
- H01 - BASIC ELECTRIC ELEMENTS