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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
Patent number
9,881,863
Issue date
Jan 30, 2018
UTAC HEADQUARTERS PTE. LTD.
Chuen Khiang Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
Patent number
9,589,875
Issue date
Mar 7, 2017
UTAC HEADQUARTERS PTE. LTD.
Chuen Khiang Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
Patent number
9,136,142
Issue date
Sep 15, 2015
United Test & Assembly Center Ltd.
Chuen Khiang Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
Patent number
8,716,873
Issue date
May 6, 2014
United Test & Assembly Center Ltd.
Chuen Khiang Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with under bump metallization aligned with op...
Patent number
8,030,768
Issue date
Oct 4, 2011
United Test & Assembly Center Ltd.
Roel Robles
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
Publication number
20170148722
Publication date
May 25, 2017
UTAC Headquarters Pte. Ltd.
Chuen Khiang WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
Publication number
20150380346
Publication date
Dec 31, 2015
UTAC Headquarters Pte. Ltd.
Chuen Khiang WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
Publication number
20140227832
Publication date
Aug 14, 2014
United Test & Assembly Center Ltd.
Chuen Khiang WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
Publication number
20120001306
Publication date
Jan 5, 2012
United Test & Assembly Center Ltd.
Chuen Khiang WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SHRINK PACKAGE ON BOARD
Publication number
20100102436
Publication date
Apr 29, 2010
United Test & Assembly Center Ltd.
Kian Teng ENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BUMP ON VIA-PACKAGING AND METHODOLOGIES
Publication number
20080284015
Publication date
Nov 20, 2008
United Test and Assembly Center, Ltd.
Roel Robles
H01 - BASIC ELECTRIC ELEMENTS