Richard W. Carpenter

Person

Johnson City, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Nanolaminated thin film circuitry materials
- Patent number 6,632,591
- Issue date Oct 14, 2003
- Andrew T. Hunt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Formation of thin film resistors
- Patent number 6,500,350
- Issue date Dec 31, 2002
- Morton International, Inc.
- Andrew T. Hunt
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Laser imaging of thin layer electronic circuitry material
- Patent number 6,388,230
- Issue date May 14, 2002
- Morton International, Inc.
- Wayne E. Nacker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin integral resistor/capacitor/inductor package, method of manufa...
- Patent number 6,356,455
- Issue date Mar 12, 2002
- Morton International, Inc.
- Richard W. Carpenter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Formation of thin film resistors
- Patent number 6,329,899
- Issue date Dec 11, 2001
- MicroCoating Technologies, Inc.
- Andrew T. Hunt
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for securing and processing thin film materials
- Patent number 6,309,805
- Issue date Oct 30, 2001
- Morton International, Inc.
- Richard W. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanolaminated thin film circuitry materials
- Patent number 6,212,078
- Issue date Apr 3, 2001
- Microcoating Technologies
- Andrew T. Hunt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Deposition of resistor materials directly on insulating substrates
- Patent number 6,210,592
- Issue date Apr 3, 2001
- Morton International, Inc.
- Andrew T. Hunt
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for providing a landless via connection
- Patent number 5,495,665
- Issue date Mar 5, 1996
- International Business Machines Corporation
- Richard W. Carpenter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming electrical connection to the inner layers of a m...
- Patent number 5,472,735
- Issue date Dec 5, 1995
- International Business Machines Corporation
- Christina M. Boyko
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Printed circuit board with aligned connections and method of making...
- Patent number 5,450,290
- Issue date Sep 12, 1995
- International Business Machines Corporation
- Christina M. Boyko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective electroetch of copper and other metals
- Patent number 5,374,338
- Issue date Dec 20, 1994
- International Business Machines Corporation
- Christina M. Boyko
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electronic circuit packages with tear resistant organic cores
- Patent number 5,103,293
- Issue date Apr 7, 1992
- International Business Machines Corporation
- Edward J. Bonafino
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Nanolaminated thin film circuitry materials
- Publication number 20010012600
- Publication date Aug 9, 2001
- Shipley Company, L.L.C.
- Andrew T. Hunt
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Richard W. Carpenter

Person

Patents Grantslast 30 patents

Nanolaminated thin film circuitry materials

Formation of thin film resistors

Laser imaging of thin layer electronic circuitry material

Thin integral resistor/capacitor/inductor package, method of manufa...

Formation of thin film resistors

Method for securing and processing thin film materials

Nanolaminated thin film circuitry materials

Deposition of resistor materials directly on insulating substrates

Process for providing a landless via connection

Method for forming electrical connection to the inner layers of a m...

Printed circuit board with aligned connections and method of making...

Selective electroetch of copper and other metals

Electronic circuit packages with tear resistant organic cores

Patents Applicationslast 30 patents

Nanolaminated thin film circuitry materials