Richard W. Plavidal

Person

Los Gatos, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Fan-out interconnect integration processes and structures
- Patent number 12,074,106
- Issue date Aug 27, 2024
- Applied Materials, Inc.
- Richard W. Plavidal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate cleaning components and methods in a plating system
- Patent number 11,814,744
- Issue date Nov 14, 2023
- Applied Materials, Inc.
- Nolan Zimmerman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Hyperbaric clean method and apparatus for cleaning semiconductor ch...
- Patent number 11,710,647
- Issue date Jul 25, 2023
- Applied Materials, Inc.
- Richard Wells Plavidal
- B08 - CLEANING
Information Patent Grant
Fan-out interconnect integration processes and structures
- Patent number 11,699,651
- Issue date Jul 11, 2023
- Applied Materials, Inc.
- Richard W. Plavidal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Drying high aspect ratio features
- Patent number 10,971,354
- Issue date Apr 6, 2021
- Applied Materials, Inc.
- Eric J. Bergman
- B08 - CLEANING
Information Patent Grant
Drying high aspect ratio features
- Patent number 10,546,762
- Issue date Jan 28, 2020
- Applied Materials, Inc.
- Eric J. Bergman
- B08 - CLEANING
Information Patent Grant
Systems and methods for wetting substrates
- Patent number 10,373,864
- Issue date Aug 6, 2019
- Applied Materials, Inc.
- Paul McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Reticle adapter for a reactive ion etch system
- Patent number 6,607,634
- Issue date Aug 19, 2003
- Applied Materials, Inc.
- Yan Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reticle adapter for a reactive ion etch system
- Patent number 6,251,217
- Issue date Jun 26, 2001
- Applied Materials, Inc.
- Yan Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetically-enhanced plasma chamber with non-uniform magnetic field
- Patent number 6,113,731
- Issue date Sep 5, 2000
- Applied Materials, Inc.
- Hongching Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radial magnetic field enhancement for plasma processing
- Patent number 5,718,795
- Issue date Feb 17, 1998
- Applied Materials, Inc.
- Richard W. Plavidal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heated removable throttle valve
- Patent number 5,462,080
- Issue date Oct 31, 1995
- Applied Materials, Inc.
- Richard W. Plavidal
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...

Patents Applicationslast 30 patents

Information Patent Application
PLATING SYSTEMS HAVING REDUCED AIR ENTRAINMENT
- Publication number 20230349064
- Publication date Nov 2, 2023
- Applied Materials, Inc.
- Cameron Law
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FAN-OUT INTERCONNECT INTEGRATION PROCESSES AND STRUCTURES
- Publication number 20230352402
- Publication date Nov 2, 2023
- Applied Materials, Inc.
- Richard W. Plavidal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYPERBARIC CLEAN METHOD AND APPARATUS FOR CLEANING SEMICONDUCTOR CH...
- Publication number 20220238355
- Publication date Jul 28, 2022
- Richard Wells PLAVIDAL
- B08 - CLEANING
Information Patent Application
PLATING SYSTEMS HAVING REDUCED AIR ENTRAINMENT
- Publication number 20200152467
- Publication date May 14, 2020
- Applied Materials, Inc.
- Cameron Law
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE CLEANING COMPONENTS AND METHODS IN A PLATING SYSTEM
- Publication number 20190301049
- Publication date Oct 3, 2019
- Applied Materials, Inc.
- Nolan Zimmerman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FAN-OUT INTERCONNECT INTEGRATION PROCESSES AND STRUCTURES
- Publication number 20190122981
- Publication date Apr 25, 2019
- Applied Materials, Inc.
- Richard W. Plavidal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR WETTING SUBSTRATES
- Publication number 20180182664
- Publication date Jun 28, 2018
- Applied Materials, Inc.
- Paul McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DRYING HIGH ASPECT RATIO FEATURES
- Publication number 20180144954
- Publication date May 24, 2018
- Applied Materials, Inc.
- Eric J. Bergman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRYING HIGH ASPECT RATIO FEATURES
- Publication number 20180019119
- Publication date Jan 18, 2018
- Applied Materials Inc,
- Eric J. Bergman
- B08 - CLEANING
Information Patent Application
Reticle adapter for a reactive ion etch system
- Publication number 20010022216
- Publication date Sep 20, 2001
- Materials, Inc.
- Yan Ye
- H01 - BASIC ELECTRIC ELEMENTS

Richard W. Plavidal

Person

Patents Grantslast 30 patents

Fan-out interconnect integration processes and structures

Substrate cleaning components and methods in a plating system

Hyperbaric clean method and apparatus for cleaning semiconductor ch...

Fan-out interconnect integration processes and structures

Drying high aspect ratio features

Drying high aspect ratio features

Systems and methods for wetting substrates

Reticle adapter for a reactive ion etch system

Reticle adapter for a reactive ion etch system

Magnetically-enhanced plasma chamber with non-uniform magnetic field

Radial magnetic field enhancement for plasma processing

Heated removable throttle valve

Patents Applicationslast 30 patents

PLATING SYSTEMS HAVING REDUCED AIR ENTRAINMENT

FAN-OUT INTERCONNECT INTEGRATION PROCESSES AND STRUCTURES

HYPERBARIC CLEAN METHOD AND APPARATUS FOR CLEANING SEMICONDUCTOR CH...

PLATING SYSTEMS HAVING REDUCED AIR ENTRAINMENT

SUBSTRATE CLEANING COMPONENTS AND METHODS IN A PLATING SYSTEM

FAN-OUT INTERCONNECT INTEGRATION PROCESSES AND STRUCTURES

SYSTEMS AND METHODS FOR WETTING SUBSTRATES

DRYING HIGH ASPECT RATIO FEATURES

DRYING HIGH ASPECT RATIO FEATURES

Reticle adapter for a reactive ion etch system