Richard Zhao

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Portland, OR, US

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Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for assembling multi-core dice using sockets w...
- Patent number 7,602,616
- Issue date Oct 13, 2009
- Intel Corporation
- Richard Zhao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
On-die termination method for multi-chip packages
- Patent number 7,602,056
- Issue date Oct 13, 2009
- Intel Corporation
- Richard Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electro-mechanical heat sink gasket for shock and vibration protect...
- Patent number 6,390,475
- Issue date May 21, 2002
- Intel Corporation
- Michael Z. Eckblad
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...

Patents Applicationslast 30 patents

Information Patent Application
On-die termination method for multi-chip packages
- Publication number 20070290323
- Publication date Dec 20, 2007
- Richard Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assembling multi-core dice using sockets with multiple sets of fron...
- Publication number 20070216018
- Publication date Sep 20, 2007
- Richard Zhao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR