Rick Canham

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Portland, OR, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of placing a chip assembly in a socket housing
- Patent number 8,904,630
- Issue date Dec 9, 2014
- Intel Corporation
- Rick Canham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sliding package retention device for LGA sockets
- Patent number 8,151,450
- Issue date Apr 10, 2012
- Intel Corporation
- Rick Canham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGES INCLUDING CARRIERS WITH INCORPORATED SU...
- Publication number 20240357744
- Publication date Oct 24, 2024
- Intel Corporation
- Rick Canham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOCKET INTERFACE FRAMES FOR DEVICES WITH IMPROVED-PERFORMANCE SUBST...
- Publication number 20240222288
- Publication date Jul 4, 2024
- Intel Corporation
- David Shia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE INTEGRATED TORSION LOADING MECHANISM
- Publication number 20230395460
- Publication date Dec 7, 2023
- Intel Corporation
- David Shia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLIDING PACKAGE RETENTION DEVICE FOR LGA SOCKETS
- Publication number 20120151762
- Publication date Jun 21, 2012
- Rick Canham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SLIDING PACKAGE RETENTION DEVICE FOR LGA SOCKETS
- Publication number 20100162561
- Publication date Jul 1, 2010
- Rick Canham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR