Rick Lee Tiefel

Person

  • Clay City, IN, US

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    Splicing assembly and method

    • Publication number 20060272763
    • Publication date Dec 7, 2006
    • SONY CORPORATION
    • Rick Lee Tiefel
    • B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL