Rickie C. Lake

Person

Meridian, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods of forming curved image sensors
- Patent number 9,998,643
- Issue date Jun 12, 2018
- Semiconductor Components Industries, LLC
- Marc Allen Sulfridge
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Microfeature workpieces having alloyed conductive structures, and a...
- Patent number 9,737,947
- Issue date Aug 22, 2017
- Micron Technology, Inc.
- Warren M. Farnworth
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for forming conductive elements and vias on substrates and...
- Patent number 9,153,491
- Issue date Oct 6, 2015
- Micron Technology, Inc.
- Rickie C. Lake
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Methods for forming conductive elements and vias on substrates
- Patent number 8,835,293
- Issue date Sep 16, 2014
- Micron Technology, Inc.
- Rickie C. Lake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing
- Patent number 8,415,233
- Issue date Apr 9, 2013
- Micron Technology, Inc.
- Rickie C. Lake
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method and apparatus for RFID communication
- Patent number RE43940
- Issue date Jan 22, 2013
- Round Rock Research, LLC
- Mark E. Tuttle
- 714 - Error detection/correction and fault detection/recovery
Information Patent Grant
Method and apparatus for RFID communication
- Patent number RE43935
- Issue date Jan 15, 2013
- Round Rock Research, LLC
- Mark E. Tuttle
- 714 - Error detection/correction and fault detection/recovery
Information Patent Grant
Method and apparatus for RFID communication
- Patent number RE43918
- Issue date Jan 8, 2013
- Round Rock Research, LLC
- Mark E. Tuttle
- 714 - Error detection/correction and fault detection/recovery
Information Patent Grant
Methods of forming conductive vias through substrates, and structur...
- Patent number 8,183,151
- Issue date May 22, 2012
- Micron Technology, Inc.
- Rickie C. Lake
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method and apparatus for communicating with RFID devices coupled to...
- Patent number RE42872
- Issue date Oct 25, 2011
- Round Rock Research, LLC
- Mark E. Tuttle
- 714 - Error detection/correction and fault detection/recovery
Information Patent Grant
Method of manufacturing an enclosed transceiver
- Patent number RE42773
- Issue date Oct 4, 2011
- Round Rock Research, LLC
- Mark E. Tuttle
- 235 - Registers
Information Patent Grant
Wafer processing
- Patent number 7,972,940
- Issue date Jul 5, 2011
- Micron Technology, Inc.
- Rickie C. Lake
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method and apparatus for step-and-repeat molding
- Patent number 7,968,042
- Issue date Jun 28, 2011
- Aptina Imaging Corporation
- Rickie C. Lake
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Optic wafer with reliefs, wafer assembly including same and methods...
- Patent number 7,927,916
- Issue date Apr 19, 2011
- Micron Technology, Inc.
- Rickie C. Lake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a permanent carrier and spacer wafer for wafer le...
- Patent number 7,888,758
- Issue date Feb 15, 2011
- Aptina Imaging Corporation
- Rickie C. Lake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spacers for packaged microelectronic imagers and methods of making...
- Patent number 7,723,741
- Issue date May 25, 2010
- Aptina Imaging Corporation
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrates including vias of nonuniform cross-section...
- Patent number 7,687,916
- Issue date Mar 30, 2010
- Micron Technology, Inc.
- Rickie C. Lake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin profile battery bonding method, method of conductively interco...
- Patent number 7,511,616
- Issue date Mar 31, 2009
- Keystone Technology Solutions, LLC
- Rickie C. Lake
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor substrates including vias of nonuniform cross section...
- Patent number 7,425,507
- Issue date Sep 16, 2008
- Micron Technology, Inc.
- Rickie C. Lake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming integrated circuits within substrates
- Patent number RE40137
- Issue date Mar 4, 2008
- Micron Technology, Inc.
- Mark E. Tuttle
- 438 - Semiconductor device manufacturing: process
Information Patent Grant
Spacers for packaged microelectronic imagers and methods of making...
- Patent number 7,223,626
- Issue date May 29, 2007
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer backside removal to complete through-holes and provide wafer...
- Patent number 7,199,449
- Issue date Apr 3, 2007
- Micron Technology, Inc.
- Rickie C. Lake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epoxy, epoxy system, and method of forming a conductive adhesive co...
- Patent number 6,902,689
- Issue date Jun 7, 2005
- Micron Technology, Inc.
- Rickie C. Lake
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Battery powerable apparatus, radio frequency communication device,...
- Patent number 6,885,089
- Issue date Apr 26, 2005
- Micron Technology, Inc.
- Rickie C. Lake
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical apparatuses, methods of forming electrical apparatuses,...
- Patent number 6,882,284
- Issue date Apr 19, 2005
- Micron Technology, Inc.
- Rickie C. Lake
- A01 - AGRICULTURE FORESTRY ANIMAL HUSBANDRY HUNTING TRAPPING FISHING
Information Patent Grant
Method of conductively interconnecting electronic components, batte...
- Patent number 6,881,294
- Issue date Apr 19, 2005
- Micron Technology, Inc.
- Rickie C. Lake
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a wireless radio frequency identification device
- Patent number 6,666,379
- Issue date Dec 23, 2003
- Micron Technology, Inc.
- Rickie C. Lake
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electrical apparatuses, and methods of forming electrical apparatuses
- Patent number 6,630,887
- Issue date Oct 7, 2003
- Micron Technology, Inc.
- Rickie C. Lake
- A01 - AGRICULTURE FORESTRY ANIMAL HUSBANDRY HUNTING TRAPPING FISHING
Information Patent Grant
RADIO FREQUENCY-TRANSMISSIVE COMPOSITIONS, METHODS OF FORMING RADIO...
- Patent number 6,522,023
- Issue date Feb 18, 2003
- Micron Technology, Inc.
- Rickie C. Lake
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Termite sensing methods
- Patent number 6,515,591
- Issue date Feb 4, 2003
- Micron Technology, Inc.
- Rickie C. Lake
- A01 - AGRICULTURE FORESTRY ANIMAL HUSBANDRY HUNTING TRAPPING FISHING

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF FORMING CURVED IMAGE SENSORS
- Publication number 20160286102
- Publication date Sep 29, 2016
- Semiconductor Components Industries, LLC
- Marc Allen SULFRIDGE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHODS FOR FORMING CONDUCTIVE ELEMENTS AND VIAS ON SUBSTRATES AND...
- Publication number 20150031171
- Publication date Jan 29, 2015
- Micron Technology, Inc.
- Rickie C. Lake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROFEATURE WORKPIECES HAVING ALLOYED CONDUCTIVE STRUCTURES, AND A...
- Publication number 20140284375
- Publication date Sep 25, 2014
- Micron Technology, Inc.
- Warren M. Farnworth
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR WAFER-TO-WAFER BONDING
- Publication number 20120186741
- Publication date Jul 26, 2012
- APTINA IMAGING CORPORATION
- RICKIE C. LAKE
- B32 - LAYERED PRODUCTS
Information Patent Application
METHODS FOR FORMING CONDUCTIVE ELEMENTS AND VIAS ON SUBSTRATES
- Publication number 20120175341
- Publication date Jul 12, 2012
- Micron Technology, Inc.
- Rickie C. Lake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING
- Publication number 20110233705
- Publication date Sep 29, 2011
- Micron Technology, Inc.
- Rickie C. Lake
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Apparatus and Method of Manufacture for Movable Lens on Transparent...
- Publication number 20100123209
- Publication date May 20, 2010
- Jacques Duparre
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD AND APPARATUS FOR STEP-AND-REPEAT MOLDING
- Publication number 20090261516
- Publication date Oct 22, 2009
- Micron Technology, Inc.
- Rickie C. Lake
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method of forming a permanent carrier and spacer wafer for wafer le...
- Publication number 20090231826
- Publication date Sep 17, 2009
- Micron Technology, Inc.
- Rickie C. Lake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING
- Publication number 20090166782
- Publication date Jul 2, 2009
- Micron Technology, Inc.
- Rickie C. Lake
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Thin Profile Battery Bonding Method, Method Of Conductively Interco...
- Publication number 20080291027
- Publication date Nov 27, 2008
- RICKIE C. LAKE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF FORMING CONDUCTIVE VIAS THROUGH SUBSTRATES, AND STRUCTUR...
- Publication number 20080272497
- Publication date Nov 6, 2008
- Micron Technology, Inc.
- Rickie C. Lake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATES INCLUDING VIAS OF NONUNIFORM CROSS SECTION...
- Publication number 20080272466
- Publication date Nov 6, 2008
- Micron Technology, Inc.
- Rickie C. Lake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optic wafer with reliefs, wafer assembly including same and methods...
- Publication number 20080246066
- Publication date Oct 9, 2008
- Micron Technology, Inc.
- Rickie C. Lake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUSES FOR RELEASABLY ATTACHING MICROFEATURE WORKP...
- Publication number 20070134471
- Publication date Jun 14, 2007
- Micron Technology, Inc.
- Rickie C. Lake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor substrates including vias of nonuniform cross section...
- Publication number 20060292877
- Publication date Dec 28, 2006
- Rickie C. Lake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Spacers for packaged microelectronic imagers and methods of making...
- Publication number 20060234422
- Publication date Oct 19, 2006
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and apparatus for releasably attaching microfeature workpie...
- Publication number 20060162850
- Publication date Jul 27, 2006
- Micron Technology, Inc.
- Rickie C. Lake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer backside removal to complete through-holes and provide wafer...
- Publication number 20060043533
- Publication date Mar 2, 2006
- Rickie C. Lake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Spacers for packaged microelectronic imagers and methods of making...
- Publication number 20060040421
- Publication date Feb 23, 2006
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin profile battery bonding method of conductively interconnecting...
- Publication number 20040166827
- Publication date Aug 26, 2004
- Micron Technology, Inc.
- Rickie C. Lake
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrical apparatuses, methods of forming electrical apparatuses,...
- Publication number 20030128119
- Publication date Jul 10, 2003
- Rickie C. Lake
- A01 - AGRICULTURE FORESTRY ANIMAL HUSBANDRY HUNTING TRAPPING FISHING
Information Patent Application
Method of fabricating a wireless radio frequency identification device
- Publication number 20030057287
- Publication date Mar 27, 2003
- Rickie C. Lake
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THIN PROFILE BATTERY BONDING METHOD, METHOD OF CONDUCTIVELY INTERCO...
- Publication number 20020179239
- Publication date Dec 5, 2002
- RICKIE C. LAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Battery powerable apparatus, radio frequency communication device,...
- Publication number 20020035780
- Publication date Mar 28, 2002
- Rickie C. Lake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A REMOTE INTELLIGENT COMMUNICATIONS DEVICE
- Publication number 20020030111
- Publication date Mar 14, 2002
- RICKIE C. LAKE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Radio frequency-transmissive compositions, methods of forming radio...
- Publication number 20010031630
- Publication date Oct 18, 2001
- Rickie C. Lake
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Epoxy, epoxy system, and method of forming a conductive adhesive co...
- Publication number 20010025947
- Publication date Oct 4, 2001
- Rickie C. Lake
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Batteries
- Publication number 20010010879
- Publication date Aug 2, 2001
- Rickie C. Lake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing an enclosed transceiver
- Publication number 20010007335
- Publication date Jul 12, 2001
- Mark E. Tuttle
- G01 - MEASURING TESTING

Rickie C. Lake

Person

Patents Grantslast 30 patents

Methods of forming curved image sensors

Microfeature workpieces having alloyed conductive structures, and a...

Methods for forming conductive elements and vias on substrates and...

Methods for forming conductive elements and vias on substrates

Wafer processing

Method and apparatus for RFID communication

Method and apparatus for RFID communication

Method and apparatus for RFID communication

Methods of forming conductive vias through substrates, and structur...

Method and apparatus for communicating with RFID devices coupled to...

Method of manufacturing an enclosed transceiver

Wafer processing

Method and apparatus for step-and-repeat molding

Optic wafer with reliefs, wafer assembly including same and methods...

Method of forming a permanent carrier and spacer wafer for wafer le...

Spacers for packaged microelectronic imagers and methods of making...

Semiconductor substrates including vias of nonuniform cross-section...

Thin profile battery bonding method, method of conductively interco...

Semiconductor substrates including vias of nonuniform cross section...

Methods for forming integrated circuits within substrates

Spacers for packaged microelectronic imagers and methods of making...

Wafer backside removal to complete through-holes and provide wafer...

Epoxy, epoxy system, and method of forming a conductive adhesive co...

Battery powerable apparatus, radio frequency communication device,...

Electrical apparatuses, methods of forming electrical apparatuses,...

Method of conductively interconnecting electronic components, batte...

Method of fabricating a wireless radio frequency identification device

Electrical apparatuses, and methods of forming electrical apparatuses

RADIO FREQUENCY-TRANSMISSIVE COMPOSITIONS, METHODS OF FORMING RADIO...

Termite sensing methods

Patents Applicationslast 30 patents

METHODS OF FORMING CURVED IMAGE SENSORS

METHODS FOR FORMING CONDUCTIVE ELEMENTS AND VIAS ON SUBSTRATES AND...

MICROFEATURE WORKPIECES HAVING ALLOYED CONDUCTIVE STRUCTURES, AND A...

APPARATUS FOR WAFER-TO-WAFER BONDING

METHODS FOR FORMING CONDUCTIVE ELEMENTS AND VIAS ON SUBSTRATES

WAFER PROCESSING

Apparatus and Method of Manufacture for Movable Lens on Transparent...

METHOD AND APPARATUS FOR STEP-AND-REPEAT MOLDING

Method of forming a permanent carrier and spacer wafer for wafer le...

WAFER PROCESSING

Thin Profile Battery Bonding Method, Method Of Conductively Interco...

METHODS OF FORMING CONDUCTIVE VIAS THROUGH SUBSTRATES, AND STRUCTUR...

SEMICONDUCTOR SUBSTRATES INCLUDING VIAS OF NONUNIFORM CROSS SECTION...

Optic wafer with reliefs, wafer assembly including same and methods...

METHODS AND APPARATUSES FOR RELEASABLY ATTACHING MICROFEATURE WORKP...

Semiconductor substrates including vias of nonuniform cross section...

Spacers for packaged microelectronic imagers and methods of making...

Methods and apparatus for releasably attaching microfeature workpie...

Wafer backside removal to complete through-holes and provide wafer...

Spacers for packaged microelectronic imagers and methods of making...

Thin profile battery bonding method of conductively interconnecting...

Electrical apparatuses, methods of forming electrical apparatuses,...

Method of fabricating a wireless radio frequency identification device

THIN PROFILE BATTERY BONDING METHOD, METHOD OF CONDUCTIVELY INTERCO...

Battery powerable apparatus, radio frequency communication device,...

METHOD OF FABRICATING A REMOTE INTELLIGENT COMMUNICATIONS DEVICE

Radio frequency-transmissive compositions, methods of forming radio...

Epoxy, epoxy system, and method of forming a conductive adhesive co...

Batteries

Method of manufacturing an enclosed transceiver