RICKY AGRAWAL

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IRVING, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Pad defined contact for wafer level package
- Patent number 10,204,876
- Issue date Feb 12, 2019
- Maxim Integrated Products, Inc.
- Tiao Zhou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PAD DEFINED CONTACT FOR WAFER LEVEL PACKAGE
- Publication number 20140252592
- Publication date Sep 11, 2014
- Maxim Integrated Products, Inc.
- Tiao Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGING WITH HEAT DISSIPATION
- Publication number 20110233756
- Publication date Sep 29, 2011
- MAXIM INTEGRATED PRODUCTS, INC.
- VIREN KHANDEKAR
- H01 - BASIC ELECTRIC ELEMENTS