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Interconnect substrate
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Patent number 11,792,927
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Issue date Oct 17, 2023
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Shinko Electric Industries Co., Ltd.
-
Rie Mizutani
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Wiring board
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Patent number 11,729,914
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Issue date Aug 15, 2023
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Shinko Electric Industries Co. Ltd.
-
Hiroshi Taneda
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H01 - BASIC ELECTRIC ELEMENTS
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Wiring board
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Patent number 11,716,810
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Issue date Aug 1, 2023
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Shinko Electric Industries Co., Ltd.
-
Masaya Takizawa
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Wiring board
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Patent number 10,804,210
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Issue date Oct 13, 2020
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Shinko Electric Industries Co., Ltd.
-
Rie Mizutani
-
H01 - BASIC ELECTRIC ELEMENTS
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Wiring board
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Patent number 10,743,403
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Issue date Aug 11, 2020
-
Shinko Electric Industries Co., Ltd.
-
Rie Mizutani
-
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR