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Rieka Ohuchi
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Tokyo, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor apparatus and a semiconductor device mounting method
Patent number
6,538,335
Issue date
Mar 25, 2003
NEC Corporation
Toshiyasu Shimada
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device with reliable connection between projective el...
Patent number
6,344,372
Issue date
Feb 5, 2002
NEC Corporation
Rieka Ohuchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Resin film and a method for connecting electronic parts by the use...
Patent number
6,311,888
Issue date
Nov 6, 2001
NEC Corporation
Yoshitsugu Funada
B32 - LAYERED PRODUCTS
Information
Patent Grant
Resin film and a method for connecting electronic parts by the use...
Patent number
6,214,446
Issue date
Apr 10, 2001
NEC Corporation
Yoshitsugu Funada
B32 - LAYERED PRODUCTS
Information
Patent Grant
Semiconductor device with high reliability of connection between pr...
Patent number
6,197,617
Issue date
Mar 6, 2001
NEC Corporation
Rieka Ohuchi
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Semiconductor apparatus and a semiconductor device mounting method
Publication number
20020100988
Publication date
Aug 1, 2002
NEC Corporation
Toshiyasu Shimada
H01 - BASIC ELECTRIC ELEMENTS