Rikiya Katoh

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Sohka-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Lead-free solder paste
- Patent number 6,554,180
- Issue date Apr 29, 2003
- Senju Metal Industry Co., Ltd.
- Rikiya Katoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder alloys
- Patent number 6,503,338
- Issue date Jan 7, 2003
- Senju Metal Industry Co., Ltd.
- Toshihiko Taguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder paste for chip components
- Patent number 6,050,480
- Issue date Apr 18, 2000
- Senju Metal Industry, Co., Ltd.
- Toshihiko Taguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Lead-free solder alloys
- Publication number 20030021719
- Publication date Jan 30, 2003
- Senju Metal Industry Co., Ltd.
- Toshihiko Taguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR