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Rina Chowdhury
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Austin, TX, US
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last 30 patents
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Patent Grant
Method and apparatus for manufacturing an interconnect structure
Patent number
6,429,531
Issue date
Aug 6, 2002
Motorola, Inc.
Addi B. Mistry
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming a copper layer over a semiconductor wafer
Patent number
6,297,155
Issue date
Oct 2, 2001
Motorola Inc.
Cindy Reidsema Simpson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for protecting the edge exclusion of a semiconductor wafer f...
Patent number
6,268,289
Issue date
Jul 31, 2001
Motorola Inc.
Rina Chowdhury
H01 - BASIC ELECTRIC ELEMENTS