Membership
Tour
Register
Log in
Risa Miyazawa
Follow
Person
Isehara, JP
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Silicon handler with laser-release layers
Patent number
11,908,723
Issue date
Feb 20, 2024
International Business Machines Corporation
Akihiro Horibe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Side pad anchored by next adjacent via
Patent number
11,735,529
Issue date
Aug 22, 2023
International Business Machines Corporation
Takahito Watanabe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fabricating an interconnection using a sacrificial layer
Patent number
11,574,817
Issue date
Feb 7, 2023
International Business Machines Corporation
Takahito Watanabe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Prevention of bridging between solder joints
Patent number
11,456,269
Issue date
Sep 27, 2022
International Business Machines Corporation
Risa Miyazawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnection with side connection to substrate
Patent number
11,264,314
Issue date
Mar 1, 2022
International Business Machines Corporation
Risa Miyazawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Resist structure for forming bumps
Patent number
11,164,845
Issue date
Nov 2, 2021
International Business Machines Corporation
Eiji Nakamura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Prevention of bridging between solder joints
Patent number
11,004,819
Issue date
May 11, 2021
International Business Machines Corporation
Risa Miyazawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electron device stack structure
Patent number
10,903,526
Issue date
Jan 26, 2021
International Business Machines Corporation
Kuniaki Sueoka
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SILICON HANDLER WITH LASER-RELEASE LAYERS
Publication number
20230178404
Publication date
Jun 8, 2023
International Business Machines Corporation
Akihiro Horibe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
UNDERFILL VACUUM PROCESS
Publication number
20230178445
Publication date
Jun 8, 2023
International Business Machines Corporation
Toyohiro Aoki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SIDE PAD ANCHORED BY NEXT ADJACENT VIA
Publication number
20220375867
Publication date
Nov 24, 2022
International Business Machines Corporation
Takahito Watanabe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FABRICATING AN INTERCONNECTION USING A SACRIFICIAL LAYER
Publication number
20220359227
Publication date
Nov 10, 2022
International Business Machines Corporation
Takahito Watanabe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RESIST STRUCTURE FOR FORMING BUMPS
Publication number
20210242164
Publication date
Aug 5, 2021
International Business Machines Corporation
Eiji Nakamura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PREVENTION OF BRIDGING BETWEEN SOLDER JOINTS
Publication number
20210210454
Publication date
Jul 8, 2021
International Business Machines Corporation
Risa Miyazawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECTION WITH SIDE CONNECTION TO SUBSTRATE
Publication number
20210098349
Publication date
Apr 1, 2021
International Business Machines Corporation
Risa Miyazawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PREVENTION OF BRIDGING BETWEEN SOLDER JOINTS
Publication number
20210098404
Publication date
Apr 1, 2021
International Business Machines Corporation
Risa Miyazawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRON DEVICE STACK STRUCTURE
Publication number
20200176821
Publication date
Jun 4, 2020
International Business Machines Corporation
Kuniaki Sueoka
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...