Rishabh Mehandru

Person

Beaverton, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Fin doping and integrated circuit structures resulting therefrom
- Patent number 12,199,098
- Issue date Jan 14, 2025
- Intel Corporation
- Aaron D. Lilak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wrap-around contact structures for semiconductor nanowires and nano...
- Patent number 12,176,429
- Issue date Dec 24, 2024
- Intel Corporation
- Rishabh Mehandru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect techniques for electrically connecting source/drain re...
- Patent number 12,107,085
- Issue date Oct 1, 2024
- Intel Corporation
- Aaron D. Lilak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically stacked finFETs and shared gate patterning
- Patent number 12,100,623
- Issue date Sep 24, 2024
- Intel Corporation
- Aaron Lilak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench via for three-dimensional integrated circuit
- Patent number 12,100,705
- Issue date Sep 24, 2024
- Intel Corporation
- Yih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked transistors
- Patent number 12,057,494
- Issue date Aug 6, 2024
- Intel Corporation
- Patrick Morrow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation wall stressor structures to improve channel stress and th...
- Patent number 12,033,896
- Issue date Jul 9, 2024
- Intel Corporation
- Aaron D. Lilak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device with crenellated metal trace layout
- Patent number 11,996,362
- Issue date May 28, 2024
- Intel Corporation
- Patrick Morrow
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Field effect transistor having a gate dielectric with a dipole laye...
- Patent number 11,984,506
- Issue date May 14, 2024
- Intel Corporation
- Vishal Tiwari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sideways vias in isolation areas to contact interior layers in stac...
- Patent number 11,942,416
- Issue date Mar 26, 2024
- Intel Corporation
- Ehren Mannebach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit contact structures
- Patent number 11,942,526
- Issue date Mar 26, 2024
- Intel Corporation
- Patrick Morrow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-silicon N-type and P-type stacked transistors for integrated ci...
- Patent number 11,935,891
- Issue date Mar 19, 2024
- Intel Corporation
- Gilbert Dewey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside contact structures and fabrication for metal on both sides...
- Patent number 11,935,933
- Issue date Mar 19, 2024
- Intel Corporation
- Patrick Morrow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sub-fin leakage reduction for template strained materials
- Patent number 11,923,412
- Issue date Mar 5, 2024
- Intel Corporation
- Rishabh Mehandru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin shaping and integrated circuit structures resulting therefrom
- Patent number 11,901,457
- Issue date Feb 13, 2024
- Intel Corporation
- Szuya S. Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back side processing of integrated circuit structures to form insul...
- Patent number 11,894,262
- Issue date Feb 6, 2024
- Intel Corporation
- Aaron D. Lilak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked transistors with contact last
- Patent number 11,869,890
- Issue date Jan 9, 2024
- Intel Corporation
- Ravi Pillarisetty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate-all-around integrated circuit structures having insulator FIN...
- Patent number 11,862,702
- Issue date Jan 2, 2024
- Intel Corporation
- Aaron D. Lilak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device structures and double-sided electrical te...
- Patent number 11,854,894
- Issue date Dec 26, 2023
- Intel Corporation
- Valluri R. Rao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor contact area enhancement
- Patent number 11,843,052
- Issue date Dec 12, 2023
- Intel Corporation
- Rishabh Mehandru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wrap-around contact structures for semiconductor nanowires and nano...
- Patent number 11,824,107
- Issue date Nov 21, 2023
- Intel Corporation
- Rishabh Mehandru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact architecture for capacitance reduction and satisfactory con...
- Patent number 11,824,097
- Issue date Nov 21, 2023
- Intel Corporation
- Rishabh Mehandru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Amorphization and regrowth of source-drain regions from the bottom-...
- Patent number 11,798,991
- Issue date Oct 24, 2023
- Intel Corporation
- Aaron Lilak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitance reduction for semiconductor devices based on wafer bonding
- Patent number 11,798,838
- Issue date Oct 24, 2023
- Intel Corporation
- Ehren Mannebach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect techniques for electrically connecting source/drain re...
- Patent number 11,742,346
- Issue date Aug 29, 2023
- Intel Corporation
- Aaron D. Lilak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film transistors having U-shaped features
- Patent number 11,721,735
- Issue date Aug 8, 2023
- Intel Corporation
- Gilbert Dewey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation schemes for gate-all-around transistor devices
- Patent number 11,705,518
- Issue date Jul 18, 2023
- Intel Corporation
- Rishabh Mehandru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep source and drain for transistor structures with back-side cont...
- Patent number 11,688,780
- Issue date Jun 27, 2023
- Intel Corporation
- Rishabh Mehandru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wrap-around contact structures for semiconductor fins
- Patent number 11,688,637
- Issue date Jun 27, 2023
- Intel Corporation
- Rishabh Mehandru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forksheet transistor architectures
- Patent number 11,664,377
- Issue date May 30, 2023
- Intel Corporation
- Aaron D. Lilak
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKED TRANSISTORS
- Publication number 20240332403
- Publication date Oct 3, 2024
- Intel Corporation
- Patrick MORROW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE STRUCTURES AND DOUBLE-SIDED ELECTRICAL TE...
- Publication number 20240194533
- Publication date Jun 13, 2024
- Intel Corporation
- Valluri R. RAO
- G01 - MEASURING TESTING
Information Patent Application
SIDEWAYS VIAS IN ISOLATION AREAS TO CONTACT INTERIOR LAYERS IN STAC...
- Publication number 20240162141
- Publication date May 16, 2024
- Intel Corporation
- Ehren MANNEBACH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT STRUCTURES AND FABRICATION FOR METAL ON BOTH SIDES...
- Publication number 20240154011
- Publication date May 9, 2024
- Intel Corporation
- Patrick MORROW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CONTACT STRUCTURES
- Publication number 20240128340
- Publication date Apr 18, 2024
- Intel Corporation
- Patrick Morrow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING INSULATOR FIN...
- Publication number 20240088254
- Publication date Mar 14, 2024
- Intel Corporation
- Aaron D. LILAK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WRAP-AROUND CONTACT STRUCTURES FOR SEMICONDUCTOR NANOWIRES AND NANO...
- Publication number 20240047566
- Publication date Feb 8, 2024
- Intel Corporation
- Rishabh MEHANDRU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT ARCHITECTURE FOR CAPACITANCE REDUCTION AND SATISFACTORY CON...
- Publication number 20240038857
- Publication date Feb 1, 2024
- Intel Corporation
- Rishabh MEHANDRU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING ULTRA-HIGH CONDUCTIVITY GLOBAL...
- Publication number 20240006416
- Publication date Jan 4, 2024
- Intel Corporation
- Abhishek Anil SHARMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AMORPHIZATION AND REGROWTH OF SOURCE-DRAIN REGIONS FROM THE BOTTOM-...
- Publication number 20240006489
- Publication date Jan 4, 2024
- Intel Corporation
- Aaron LILAK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING MEMORY ACCESS TRANSISTOR WITH...
- Publication number 20240008253
- Publication date Jan 4, 2024
- Intel Corporation
- Abhishek Anil SHARMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY ARRAYS WITH BACKSIDE COMPONENTS AND ANGLED TRANSISTORS
- Publication number 20240008255
- Publication date Jan 4, 2024
- Intel Corporation
- Abhishek A. Sharma
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING VERTICAL KEEPER OR POWER GATE...
- Publication number 20240006317
- Publication date Jan 4, 2024
- Intel Corporation
- Abhishek Anil SHARMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING RECESSED CHANNEL TRANSISTOR
- Publication number 20240006412
- Publication date Jan 4, 2024
- Intel Corporation
- Abhishek Anil SHARMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING RAISED EPITAXY ON CHANNEL TRAN...
- Publication number 20240006483
- Publication date Jan 4, 2024
- Intel Corporation
- Abhishek Anil SHARMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING VERTICAL TRANSISTOR
- Publication number 20240006531
- Publication date Jan 4, 2024
- Intel Corporation
- Abhishek Anil SHARMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING AIRGAPS FOR BACKSIDE SIGNAL RO...
- Publication number 20240006305
- Publication date Jan 4, 2024
- Intel Corporation
- Abhishek Anil SHARMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOGIC CIRCUITS USING VERTICAL TRANSISTORS WITH BACKSIDE SOURCE OR D...
- Publication number 20230422496
- Publication date Dec 28, 2023
- Intel Corporation
- Sagar Suthram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING MEMORY WITH BACKSIDE DRAM AND...
- Publication number 20230422485
- Publication date Dec 28, 2023
- Intel Corporation
- Abhishek Anil SHARMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT TECHNIQUES FOR ELECTRICALLY CONNECTING SOURCE/DRAIN RE...
- Publication number 20230352481
- Publication date Nov 2, 2023
- Intel Corporation
- AARON D. LILAK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING DIFFERENTIATED CHANNEL SIZING
- Publication number 20230317808
- Publication date Oct 5, 2023
- Intel Corporation
- Rishabh MEHANDRU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE SPACERS WITH ADJACENT UNIFORM EPITAXIAL MATERIAL
- Publication number 20230317822
- Publication date Oct 5, 2023
- Intel Corporation
- Stephen M. CEA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING NECKED FEATURE
- Publication number 20230317786
- Publication date Oct 5, 2023
- Intel Corporation
- Rishabh MEHANDRU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT STRUCTURES AND FABRICATION FOR METAL ON BOTH SIDES...
- Publication number 20230275135
- Publication date Aug 31, 2023
- Intel Corporation
- Patrick MORROW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUB-FIN LEAKAGE REDUCTION FOR TEMPLATE STRAINED MATERIALS
- Publication number 20230187492
- Publication date Jun 15, 2023
- Intel Corporation
- Rishabh MEHANDRU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK SIDE PROCESSING OF INTEGRATED CIRCUIT STRUCTURES TO FORM INSUL...
- Publication number 20230132053
- Publication date Apr 27, 2023
- Intel Corporation
- Aaron D. LILAK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN SHAPING AND INTEGRATED CIRCUIT STRUCTURES RESULTING THEREFROM
- Publication number 20230131126
- Publication date Apr 27, 2023
- Intel Corporation
- Szuya S. LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING HIGH MOBILITY
- Publication number 20230116170
- Publication date Apr 13, 2023
- Intel Corporation
- Roza KOTLYAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE, METHOD AND SYSTEM TO PROVIDE A STRESSED CHANNEL OF A TRANSI...
- Publication number 20230111329
- Publication date Apr 13, 2023
- Intel Corporation
- Rishabh Mehandru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING METAL-CONTAINING SOURCE OR DRA...
- Publication number 20230095007
- Publication date Mar 30, 2023
- Intel Corporation
- Rishabh MEHANDRU
- H01 - BASIC ELECTRIC ELEMENTS

Rishabh Mehandru

Person

Patents Grantslast 30 patents

Fin doping and integrated circuit structures resulting therefrom

Wrap-around contact structures for semiconductor nanowires and nano...

Interconnect techniques for electrically connecting source/drain re...

Vertically stacked finFETs and shared gate patterning

Deep trench via for three-dimensional integrated circuit

Stacked transistors

Isolation wall stressor structures to improve channel stress and th...

Integrated circuit device with crenellated metal trace layout

Field effect transistor having a gate dielectric with a dipole laye...

Sideways vias in isolation areas to contact interior layers in stac...

Integrated circuit contact structures

Non-silicon N-type and P-type stacked transistors for integrated ci...

Backside contact structures and fabrication for metal on both sides...

Sub-fin leakage reduction for template strained materials

Fin shaping and integrated circuit structures resulting therefrom

Back side processing of integrated circuit structures to form insul...

Stacked transistors with contact last

Gate-all-around integrated circuit structures having insulator FIN...

Integrated circuit device structures and double-sided electrical te...

Transistor contact area enhancement

Wrap-around contact structures for semiconductor nanowires and nano...

Contact architecture for capacitance reduction and satisfactory con...

Amorphization and regrowth of source-drain regions from the bottom-...

Capacitance reduction for semiconductor devices based on wafer bonding

Interconnect techniques for electrically connecting source/drain re...

Thin film transistors having U-shaped features

Isolation schemes for gate-all-around transistor devices

Deep source and drain for transistor structures with back-side cont...

Wrap-around contact structures for semiconductor fins

Forksheet transistor architectures

Patents Applicationslast 30 patents

STACKED TRANSISTORS

INTEGRATED CIRCUIT DEVICE STRUCTURES AND DOUBLE-SIDED ELECTRICAL TE...

SIDEWAYS VIAS IN ISOLATION AREAS TO CONTACT INTERIOR LAYERS IN STAC...

BACKSIDE CONTACT STRUCTURES AND FABRICATION FOR METAL ON BOTH SIDES...

INTEGRATED CIRCUIT CONTACT STRUCTURES

GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING INSULATOR FIN...

WRAP-AROUND CONTACT STRUCTURES FOR SEMICONDUCTOR NANOWIRES AND NANO...

CONTACT ARCHITECTURE FOR CAPACITANCE REDUCTION AND SATISFACTORY CON...

INTEGRATED CIRCUIT STRUCTURES HAVING ULTRA-HIGH CONDUCTIVITY GLOBAL...

AMORPHIZATION AND REGROWTH OF SOURCE-DRAIN REGIONS FROM THE BOTTOM-...

INTEGRATED CIRCUIT STRUCTURES HAVING MEMORY ACCESS TRANSISTOR WITH...

MEMORY ARRAYS WITH BACKSIDE COMPONENTS AND ANGLED TRANSISTORS

INTEGRATED CIRCUIT STRUCTURES HAVING VERTICAL KEEPER OR POWER GATE...

INTEGRATED CIRCUIT STRUCTURES HAVING RECESSED CHANNEL TRANSISTOR

INTEGRATED CIRCUIT STRUCTURES HAVING RAISED EPITAXY ON CHANNEL TRAN...

INTEGRATED CIRCUIT STRUCTURES HAVING VERTICAL TRANSISTOR

INTEGRATED CIRCUIT STRUCTURES HAVING AIRGAPS FOR BACKSIDE SIGNAL RO...

LOGIC CIRCUITS USING VERTICAL TRANSISTORS WITH BACKSIDE SOURCE OR D...

INTEGRATED CIRCUIT STRUCTURES HAVING MEMORY WITH BACKSIDE DRAM AND...

INTERCONNECT TECHNIQUES FOR ELECTRICALLY CONNECTING SOURCE/DRAIN RE...

INTEGRATED CIRCUIT STRUCTURES HAVING DIFFERENTIATED CHANNEL SIZING

GATE SPACERS WITH ADJACENT UNIFORM EPITAXIAL MATERIAL

GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING NECKED FEATURE

BACKSIDE CONTACT STRUCTURES AND FABRICATION FOR METAL ON BOTH SIDES...

SUB-FIN LEAKAGE REDUCTION FOR TEMPLATE STRAINED MATERIALS

BACK SIDE PROCESSING OF INTEGRATED CIRCUIT STRUCTURES TO FORM INSUL...

FIN SHAPING AND INTEGRATED CIRCUIT STRUCTURES RESULTING THEREFROM

GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING HIGH MOBILITY

DEVICE, METHOD AND SYSTEM TO PROVIDE A STRESSED CHANNEL OF A TRANSI...

INTEGRATED CIRCUIT STRUCTURES HAVING METAL-CONTAINING SOURCE OR DRA...