Ritsuji Toba

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Hadano, JP

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Patents Grantslast 30 patents

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Method for improving adhesion of a resist layer to a metallic layer...
- Patent number 5,139,923
- Issue date Aug 18, 1992
- Hitachi, Ltd.
- Ritsuji Toba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for treating interior surfaces of holes and apparatus therefor
- Patent number 5,045,353
- Issue date Sep 3, 1991
- Hitachi, Ltd.
- Yuuzi Takada
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Process for producing printed circuit board
- Patent number 5,028,513
- Issue date Jul 2, 1991
- Hitachi, Ltd.
- Kanji Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for electroless copper plating and apparatus used therefor
- Patent number 4,865,888
- Issue date Sep 12, 1989
- Hitachi, Ltd.
- Haruo Akahoshi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for pretreatment before plating through-holes of printed ci...
- Patent number 4,781,943
- Issue date Nov 1, 1988
- Hitachi, Ltd.
- Ritsuji Toba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of bonding copper and resin
- Patent number 4,642,161
- Issue date Feb 10, 1987
- Hitachi, Ltd.
- Haruo Akahoshi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...