Robbie U. Villanueva

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Il Via Bandada, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Leadless chip carrier for reduced thermal resistance
- Patent number 6,787,895
- Issue date Sep 7, 2004
- Skyworks Solutions, Inc.
- Michael J. Jarcy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip-chip leadframe package
- Patent number 6,750,546
- Issue date Jun 15, 2004
- Skyworks Solutions, Inc.
- Robbie U. Villanueva
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method suitable for forming a microelectronic device package
- Publication number 20040038451
- Publication date Feb 26, 2004
- Douglas A. Hawks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Saw alignment technique for array device singulation
- Publication number 20020114507
- Publication date Aug 22, 2002
- Mark Lynch
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Tapeless micro-leadframe
- Publication number 20020063314
- Publication date May 30, 2002
- Mathew S. Read
- H01 - BASIC ELECTRIC ELEMENTS