Robert A. Buchanan

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Madison, WI, US

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Patents Grantslast 30 patents

Information Patent Grant
Mounting bracket for heat sink module
- Patent number D809898
- Issue date Feb 13, 2018
- Ebullient, Inc.
- Brett A. Lindeman
- D08 - Tools and hardware
Information Patent Grant
Microprocessor assembly adapted for fluid cooling
- Patent number 9,852,963
- Issue date Dec 26, 2017
- Ebullient, Inc.
- Timothy A. Shedd
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
MULTI-CHAMBER HEAT SINK MODULE
- Publication number 20170105313
- Publication date Apr 13, 2017
- EBULLIENT, LLC
- Timothy A. Shedd
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SERVER WITH COOLING LINE ASSEMBLY
- Publication number 20160120071
- Publication date Apr 28, 2016
- EBULLIENT, LLC
- Timothy A. Shedd
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROPROCESSOR ASSEMBLY ADAPTED FOR FLUID COOLING
- Publication number 20160118317
- Publication date Apr 28, 2016
- EBULLIENT, LLC
- Timothy A. Shedd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE COOLING LINE ASSEMBLY
- Publication number 20160116224
- Publication date Apr 28, 2016
- EBULLIENT, LLC
- Timothy A. Shedd
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
CIRCUIT BOARD ASSEMBLY ADAPTED FOR FLUID COOLING
- Publication number 20160120019
- Publication date Apr 28, 2016
- EBULLIENT, LLC
- Timothy A. Shedd
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TWO-PHASE COOLING SYSTEM
- Publication number 20160120059
- Publication date Apr 28, 2016
- EBULLIENT, LLC
- Timothy A. Shedd
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR