Robert A. Schetty III

Person

Ft. Salonga, NY, US

People

Patents Applicationslast 30 patents

Information Patent Application
Tin electrodeposits having properties or characteristics that minim...
- Publication number 20070007144
- Publication date Jan 11, 2007
- Robert A. Schetty
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Silver barrier layers to minimize whisker growth in tin electrodepo...
- Publication number 20060292847
- Publication date Dec 28, 2006
- Robert A. Schetty
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Underlayer for reducing surface oxidation of plated deposits
- Publication number 20060240276
- Publication date Oct 26, 2006
- TECHNIC, INC.
- Robert A. Schetty
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Near neutral pH tin electroplating solution
- Publication number 20060113195
- Publication date Jun 1, 2006
- George Hradil
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Reduction of surface oxidation during electroplating
- Publication number 20060016692
- Publication date Jan 26, 2006
- TECHNIC, INC.
- Yun Zhang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Minimizing whisker growth in tin electrodeposits
- Publication number 20050145502
- Publication date Jul 7, 2005
- Robert A. Schetty
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Reduction of surface oxidation during electroplating
- Publication number 20040099340
- Publication date May 27, 2004
- Yun Zhang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Minimizing whisker growth in tin electrodeposits
- Publication number 20030201188
- Publication date Oct 30, 2003
- Robert A. Schetty
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Robert A. Schetty III

Person

Patents Applicationslast 30 patents

Tin electrodeposits having properties or characteristics that minim...

Silver barrier layers to minimize whisker growth in tin electrodepo...

Underlayer for reducing surface oxidation of plated deposits

Near neutral pH tin electroplating solution

Reduction of surface oxidation during electroplating

Minimizing whisker growth in tin electrodeposits

Reduction of surface oxidation during electroplating

Minimizing whisker growth in tin electrodeposits