Membership
Tour
Register
Log in
Robert A. Schetty III
Follow
Person
Fort Salonga, NY, US
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Seed layer repair method
Patent number
6,531,046
Issue date
Mar 11, 2003
Shipley Company, L.L.C.
Denis Morrissey
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Electrolytic copper plating method
Patent number
6,444,110
Issue date
Sep 3, 2002
Shipley Company, L.L.C.
Leon R. Barstad
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
High speed tin, lead or tin/lead alloy electroplating
Patent number
4,994,155
Issue date
Feb 19, 1991
Learonal, Inc.
Michael P. Toben
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Tin, lead or tin/lead alloy electrolytes for high speed electroplating
Patent number
4,880,507
Issue date
Nov 14, 1989
Learonal, Inc.
Michael P. Toben
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Patents Applications
last 30 patents
Information
Patent Application
Electrolytic copper plating solutions
Publication number
20060183328
Publication date
Aug 17, 2006
Leon R. Barstad
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Alloy composition and plating method
Publication number
20060065538
Publication date
Mar 30, 2006
Shipley Company, L.L.C.
Robert A. Schetty
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Electrolytic copper plating solutions
Publication number
20060065537
Publication date
Mar 30, 2006
Leon R. Barstad
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Electrolytic copper plating solutions
Publication number
20030010646
Publication date
Jan 16, 2003
Leon R. Barstad
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Alloy composition and plating method
Publication number
20020166774
Publication date
Nov 14, 2002
Shipley Company, L.L.C.
Robert A. Schetty
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Seed layer repair method
Publication number
20020000382
Publication date
Jan 3, 2002
Shipley Company, L.L.C. of Marlborough
Denis Morrissey
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
ELECTROLYTIC COPPER PLATING SOLUTIONS
Publication number
20010047943
Publication date
Dec 6, 2001
LEON BARSTAD
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR