Robert Andrew Miller

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Leuven, BE

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Patents Grantslast 30 patents

Information Patent Grant
Method of bonding semiconductor substrates
- Patent number 10,886,252
- Issue date Jan 5, 2021
- Imec VZW
- Lan Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding semiconductor substrates
- Patent number 10,141,284
- Issue date Nov 27, 2018
- Imec VZW
- Soon-Wook Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field effect transistor with interdigitated fingers and method of m...
- Patent number 8,174,054
- Issue date May 8, 2012
- RFMD (UK) Limited
- Robert Andrew Miller
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PRODUCT AND METHOD FOR MANUFACTURING A SEMICONDUCTOR...
- Publication number 20250125291
- Publication date Apr 17, 2025
- MICLEDI MICRODISPLAYS BV
- Emmanuel LE BOULBAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication of Through-Silicon Vias
- Publication number 20250098549
- Publication date Mar 20, 2025
- IMEC vzw
- Robert Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM TO PRODUCE DIES FOR A WAFER RECONSTITUTION
- Publication number 20220189830
- Publication date Jun 16, 2022
- MICLEDI MICRODISPLAYS BV
- Eric BEYNE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF BONDING SEMICONDUCTOR SUBSTRATES
- Publication number 20180247914
- Publication date Aug 30, 2018
- IMEC vzw
- Lan Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF BONDING SEMICONDUCTOR SUBSTRATES
- Publication number 20170301646
- Publication date Oct 19, 2017
- IMEC vzw
- Soon-Wook Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD EFFECT TRANSISTOR AND METHOD OF MANUFACTURE THEREOF
- Publication number 20090309137
- Publication date Dec 17, 2009
- RFMD (UK) LIMITED
- Robert Andrew Miller
- H01 - BASIC ELECTRIC ELEMENTS