Robert Bauer

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Moosach, DE

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices and methods for forming a semiconductor device
- Patent number 10,867,893
- Issue date Dec 15, 2020
- Infineon Technologies AG
- Sergey Ananiev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip arrangement, and method for forming a chip arrangement
- Patent number 9,219,031
- Issue date Dec 22, 2015
- Infineon Technologies AG
- Peter Ossimitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure integrated under a pad
- Patent number 7,190,077
- Issue date Mar 13, 2007
- Infineon Technologies AG
- Robert Bauer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Devices and Methods for Forming a Semiconductor Device
- Publication number 20180061742
- Publication date Mar 1, 2018
- INFINEON TECHNOLOGIES AG
- Sergey Ananiev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT, AND METHOD FOR FORMING A CHIP ARRANGEMENT
- Publication number 20140332953
- Publication date Nov 13, 2014
- INFINEON TECHNOLOGIES AG
- Peter Ossimitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED SENSOR CHIP UNIT
- Publication number 20100283110
- Publication date Nov 11, 2010
- Infineon Technologies AG
- Robert Bauer
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
Integrated sensor chip unit
- Publication number 20060157701
- Publication date Jul 20, 2006
- Robert Bauer
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
Semiconductor structure integrated under a pad
- Publication number 20050242374
- Publication date Nov 3, 2005
- Robert Bauer
- H01 - BASIC ELECTRIC ELEMENTS