Robert Burtzlaff

Person

Santa Clara, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer level chip packaging
- Patent number 7,936,062
- Issue date May 3, 2011
- Tessera Technologies Ireland Limited
- Giles Humpston
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Back-face and edge interconnects for lidded package
- Patent number 7,224,056
- Issue date May 29, 2007
- Tessera, Inc.
- Robert Burtzlaff
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
Wafer level chip packaging
- Publication number 20070190691
- Publication date Aug 16, 2007
- Tessera Technologies Hungary Kft.
- Giles Humpston
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wafer level packaging to lidded chips
- Publication number 20070190747
- Publication date Aug 16, 2007
- Tessera Technologies Hungary Kft.
- Giles Humpston
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Structure and method of making capped chip having discrete article...
- Publication number 20070138644
- Publication date Jun 21, 2007
- Tessera, Inc.
- Bruce M. McWilliams
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Back-face and edge interconnects for lidded package
- Publication number 20070096295
- Publication date May 3, 2007
- Tessera, Inc.
- Robert Burtzlaff
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Packaged acoustic and electromagnetic transducer chips
- Publication number 20050189622
- Publication date Sep 1, 2005
- Tessera, Inc.
- Giles Humpston
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Packaged acoustic and electromagnetic transducer chips
- Publication number 20050189635
- Publication date Sep 1, 2005
- Tessera, Inc.
- Giles Humpston
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Back-face and edge interconnects for lidded package
- Publication number 20050087861
- Publication date Apr 28, 2005
- Tessera, Inc.
- Robert Burtzlaff
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Robert Burtzlaff

Person

Patents Grantslast 30 patents

Wafer level chip packaging

Back-face and edge interconnects for lidded package

Patents Applicationslast 30 patents

Wafer level chip packaging

Wafer level packaging to lidded chips

Structure and method of making capped chip having discrete article...

Back-face and edge interconnects for lidded package

Packaged acoustic and electromagnetic transducer chips

Packaged acoustic and electromagnetic transducer chips

Back-face and edge interconnects for lidded package