Robert C. Byrne

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Sunnyvale, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Tamper resistant integrated circuit structure
- Patent number 5,369,299
- Issue date Nov 29, 1994
- National Semiconductor Corporation
- Robert C. Byrne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die sealing
- Patent number 5,136,364
- Issue date Aug 4, 1992
- National Semiconductor Corporation
- Robert C. Byrne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of making a ceramic lid for use in a hermetic seal package
- Patent number 4,833,102
- Issue date May 23, 1989
- National Semiconductor Corporation
- Robert C. Byrne
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic lid hermetic seal package structure
- Patent number 4,769,272
- Issue date Sep 6, 1988
- National Semiconductor Corporation
- Robert C. Byrne
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR