Robert C. Hartmann

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Apopka, FL, US

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Patents Grantslast 30 patents

Information Patent Grant
Substrate structure with selective surface finishes for flip chip a...
- Patent number 10,607,960
- Issue date Mar 31, 2020
- Qorvo US, Inc.
- Thomas Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure with selective surface finishes for flip chip a...
- Patent number 10,283,480
- Issue date May 7, 2019
- Qorvo US, Inc.
- Thomas Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a substrate structure with selective s...
- Patent number 9,935,066
- Issue date Apr 3, 2018
- Qorvo US, Inc.
- Thomas Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low pressure encapsulant for size-reduced semiconductor package
- Patent number 9,646,857
- Issue date May 9, 2017
- Qorvo US, Inc.
- Howard Terry Glascock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrathin flip-chip packaging techniques and configurations
- Patent number 9,269,887
- Issue date Feb 23, 2016
- TriQuint Semiconductor, Inc.
- Frank J. Juskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package with embedded passive components and method of...
- Patent number 8,680,683
- Issue date Mar 25, 2014
- TriQuint Semiconductor, Inc.
- Frank J. Juskey
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE STRUCTURE WITH SELECTIVE SURFACE FINISHES FOR FLIP CHIP A...
- Publication number 20190229087
- Publication date Jul 25, 2019
- Qorvo US, Inc.
- Thomas Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW PRESSURE ENCAPSULANT FOR SIZE-REDUCED SEMICONDUCTOR PACKAGE
- Publication number 20170047232
- Publication date Feb 16, 2017
- Qorvo US, Inc.
- Howard Terry Glascock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE WITH SELECTIVE SURFACE FINISHES FOR FLIP CHIP A...
- Publication number 20170040276
- Publication date Feb 9, 2017
- Qorvo US, Inc.
- Thomas Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A SUBSTRATE STRUCTURE WITH SELECTIVE S...
- Publication number 20170040273
- Publication date Feb 9, 2017
- Qorvo US, Inc.
- Thomas Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP PACKAGING TECHNIQUES AND CONFIGURATIONS
- Publication number 20140106511
- Publication date Apr 17, 2014
- TriQuint Semiconductor, Inc.
- Frank J. Juskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP PACKAGING TECHNIQUES AND CONFIGURATIONS
- Publication number 20130234344
- Publication date Sep 12, 2013
- TriQuint Semiconductor, Inc.
- Frank J. Juskey
- H01 - BASIC ELECTRIC ELEMENTS