Robert C. Marrs

Person

Scottsdale, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of making a packaged semiconductor die including heat sink w...
- Patent number 5,722,161
- Issue date Mar 3, 1998
- Amkor Electronics, Inc.
- Robert C. Marrs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor die including heat sink with locking feature
- Patent number 5,701,034
- Issue date Dec 23, 1997
- Amkor Electronics, Inc.
- Robert C. Marrs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array integrated circuit package with thermal conductor
- Patent number 5,583,378
- Issue date Dec 10, 1996
- Amkor Electronics, Inc.
- Robert C. Marrs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a thermal dissipator and electromagneti...
- Patent number 5,485,037
- Issue date Jan 16, 1996
- Amkor Electronics, Inc.
- Robert C. Marrs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor device having a thermal dissipat...
- Patent number 5,482,898
- Issue date Jan 9, 1996
- Amkor Electronics, Inc.
- Robert C. Marrs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with via interconnections formed in a su...
- Patent number 5,483,100
- Issue date Jan 9, 1996
- Amkor Electronics, Inc.
- Robert C. Marrs
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for interconnection of integrated circuit chip and substrate
- Patent number 5,478,007
- Issue date Dec 26, 1995
- Amkor Electronics, Inc.
- Robert C. Marrs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic molded package with heat sink for integrated circuit devices
- Patent number 5,455,462
- Issue date Oct 3, 1995
- Amkor Electronics, Inc.
- Robert C. Marrs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an integrated circuit package with via interconn...
- Patent number 5,378,869
- Issue date Jan 3, 1995
- Amkor Electronics, Inc.
- Robert C. Marrs
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ball grid array with via interconnection
- Patent number 5,355,283
- Issue date Oct 11, 1994
- Amkor Electronics, Inc.
- Robert C. Marrs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming plastic molded package with heat sink for integr...
- Patent number 5,328,870
- Issue date Jul 12, 1994
- Amkor Electronics, Inc.
- Robert C. Marrs
- H01 - BASIC ELECTRIC ELEMENTS

Robert C. Marrs

Person

Patents Grantslast 30 patents

Method of making a packaged semiconductor die including heat sink w...

Packaged semiconductor die including heat sink with locking feature

Ball grid array integrated circuit package with thermal conductor

Semiconductor device having a thermal dissipator and electromagneti...

Method for forming a semiconductor device having a thermal dissipat...

Integrated circuit package with via interconnections formed in a su...

Method for interconnection of integrated circuit chip and substrate

Plastic molded package with heat sink for integrated circuit devices

Method for forming an integrated circuit package with via interconn...

Ball grid array with via interconnection

Method for forming plastic molded package with heat sink for integr...