Robert-Christian Hagen

Person

Sarching, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device stack and method for its production
- Patent number 8,659,135
- Issue date Feb 25, 2014
- Infineon Technologies AG
- Michael Bauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead frame with non-conductive connective bar
- Patent number 7,795,712
- Issue date Sep 14, 2010
- Infineon Technologies AG
- Alvin Wee Beng Tatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component with plastic housing, and process for produ...
- Patent number 7,772,105
- Issue date Aug 10, 2010
- Infineon Technologies AG
- Ulrich Bachmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Base semiconductor component for a semiconductor component stack an...
- Patent number 7,755,178
- Issue date Jul 13, 2010
- Infineon Technologies AG
- Robert-Christian Hagen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sensor component and panel used for the production thereof
- Patent number 7,700,956
- Issue date Apr 20, 2010
- Infineon Technologies AG
- Edward Fuergut
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Smart card, smart card module, and a method for production of a sma...
- Patent number 7,575,173
- Issue date Aug 18, 2009
- Infineon Technologies, AG
- Edward Fuergut
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Biosensor with smart card configuration
- Patent number 7,566,968
- Issue date Jul 28, 2009
- Siemens Aktiengesellschaft
- Michael Bauer
- G01 - MEASURING TESTING
Information Patent Grant
Plastic package and semiconductor component comprising such a plast...
- Patent number 7,554,196
- Issue date Jun 30, 2009
- Infineon Technologies AG
- Ulrich Bachmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and a panel
- Patent number 7,524,699
- Issue date Apr 28, 2009
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a universal semiconductor housing with precross...
- Patent number 7,517,722
- Issue date Apr 14, 2009
- Infineon Technologies AG
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component comprising a semiconductor chip and a plastic...
- Patent number 7,508,083
- Issue date Mar 24, 2009
- Infineon Technologies AG
- Robert-Christian Hagen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module having plug contacts and method for producing it
- Patent number 7,391,103
- Issue date Jun 24, 2008
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component with plastic housing, and process for produ...
- Patent number 7,327,023
- Issue date Feb 5, 2008
- Infineon Technologies AG
- Ulrich Bachmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component with a plastic package and method for production
- Patent number 7,276,783
- Issue date Oct 2, 2007
- Infineon Technologies AG
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component with a stack of semiconductor chips and a meth...
- Patent number 7,190,059
- Issue date Mar 13, 2007
- Infineon Technologies AG
- Robert-Christian Hagen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component with shielding and method for its production
- Patent number 7,045,881
- Issue date May 16, 2006
- Infineon Technologies AG
- Robert-Christian Hagen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component with at least one semiconductor chip and metho...
- Patent number 6,953,992
- Issue date Oct 11, 2005
- Infineon Technologies AG
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing channels and cavities in semiconductor housing...
- Patent number 6,949,405
- Issue date Sep 27, 2005
- Infineon Technologies AG
- Robert-Christian Hagen
- G01 - MEASURING TESTING
Information Patent Grant
Electronic device configured as a multichip module, leadframe, pane...
- Patent number 6,902,951
- Issue date Jun 7, 2005
- Infineon Technologies AG
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal package for an electronic component with a semiconductor...
- Patent number 6,867,471
- Issue date Mar 15, 2005
- Infineon Technologies AG
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component with at least two stacked semiconductor chips...
- Patent number 6,710,455
- Issue date Mar 23, 2004
- Infineon Technologies AG
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and process for producing the electronic compo...
- Patent number 6,683,374
- Issue date Jan 27, 2004
- Infineon Technologies AG
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Lead Frame with Non-Conductive Connective Bar
- Publication number 20090051017
- Publication date Feb 26, 2009
- INFINEON TECHNOLOGIES AG
- Beng Tatt Wee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Base Semiconductor Component For a Semiconductor Component Stack an...
- Publication number 20080284043
- Publication date Nov 20, 2008
- Infineon Technologies AG
- Robert-Christian Hagen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Component with Plastic Housing, and Process for Produ...
- Publication number 20080050907
- Publication date Feb 28, 2008
- INFINEON TECHNOLOGIES AG
- Ulrich Bachmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Stack and Method for Its Production
- Publication number 20070278639
- Publication date Dec 6, 2007
- INFINEON TECHNOLOGIES AG
- Michael Bauer
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Sensor component and panel used for the production thereof
- Publication number 20070128754
- Publication date Jun 7, 2007
- Edward Fuergut
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Method of producing a universal semiconductor housing with precross...
- Publication number 20060258046
- Publication date Nov 16, 2006
- Infineon Technologies AG
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component comprising a semiconductor chip and a plastic...
- Publication number 20060255478
- Publication date Nov 16, 2006
- Robert-Christian Hagen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing an electronic component with shielding
- Publication number 20060183306
- Publication date Aug 17, 2006
- Infineon Technologies AG
- Robert-Christian Hagen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Smart card, smart card module, and a method for production of a sma...
- Publication number 20060175419
- Publication date Aug 10, 2006
- Edward Fuergut
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Electronic component and panel for producing the same
- Publication number 20060125042
- Publication date Jun 15, 2006
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plastic package and semiconductor component comprising such a plast...
- Publication number 20060091522
- Publication date May 4, 2006
- Ulrich Bachmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component with plastic housing, and process for produ...
- Publication number 20060076667
- Publication date Apr 13, 2006
- Ulrich Bachmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Biosensor with smart card configuration
- Publication number 20060027905
- Publication date Feb 9, 2006
- Michael Bauer
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
Electronic device configured as a multichip module, leadframe and p...
- Publication number 20050184375
- Publication date Aug 25, 2005
- Infineon Technologies AG
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic module having plug contacts and method for producing it
- Publication number 20050087851
- Publication date Apr 28, 2005
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component with a plastic housing and method for producti...
- Publication number 20040232543
- Publication date Nov 25, 2004
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device configured as a multichip module, leadframe, pane...
- Publication number 20040140559
- Publication date Jul 22, 2004
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing channels and cavities in semiconductor housing...
- Publication number 20040067603
- Publication date Apr 8, 2004
- Robert-Christian Hagen
- G01 - MEASURING TESTING
Information Patent Application
Electronic component with a stack of semiconductor chips and a meth...
- Publication number 20040063304
- Publication date Apr 1, 2004
- Robert-Christian Hagen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Universal package for an electronic component with a semiconductor...
- Publication number 20040041251
- Publication date Mar 4, 2004
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Universal semiconductor housing with precrosslinked plastic embeddi...
- Publication number 20040043515
- Publication date Mar 4, 2004
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component with at least one semiconductor chip and metho...
- Publication number 20030071336
- Publication date Apr 17, 2003
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component with at least two stacked semiconductor chips...
- Publication number 20030047813
- Publication date Mar 13, 2003
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component with at least two stacked semiconductor chips...
- Publication number 20030043555
- Publication date Mar 6, 2003
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component and process for producing the electronic compo...
- Publication number 20030042590
- Publication date Mar 6, 2003
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component with at least two stacked semiconductor chips,...
- Publication number 20030042591
- Publication date Mar 6, 2003
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component with shielding and method for its production
- Publication number 20020081819
- Publication date Jun 27, 2002
- Robert-Christian Hagen
- H01 - BASIC ELECTRIC ELEMENTS

Robert-Christian Hagen

Person

Patents Grantslast 30 patents

Semiconductor device stack and method for its production

Lead frame with non-conductive connective bar

Semiconductor component with plastic housing, and process for produ...

Base semiconductor component for a semiconductor component stack an...

Sensor component and panel used for the production thereof

Smart card, smart card module, and a method for production of a sma...

Biosensor with smart card configuration

Plastic package and semiconductor component comprising such a plast...

Electronic component and a panel

Method of producing a universal semiconductor housing with precross...

Electronic component comprising a semiconductor chip and a plastic...

Electronic module having plug contacts and method for producing it

Semiconductor component with plastic housing, and process for produ...

Electronic component with a plastic package and method for production

Electronic component with a stack of semiconductor chips and a meth...

Electronic component with shielding and method for its production

Electronic component with at least one semiconductor chip and metho...

Method for producing channels and cavities in semiconductor housing...

Electronic device configured as a multichip module, leadframe, pane...

Universal package for an electronic component with a semiconductor...

Electronic component with at least two stacked semiconductor chips...

Electronic component and process for producing the electronic compo...

Patents Applicationslast 30 patents

Lead Frame with Non-Conductive Connective Bar

Base Semiconductor Component For a Semiconductor Component Stack an...

Semiconductor Component with Plastic Housing, and Process for Produ...

Semiconductor Device Stack and Method for Its Production

Sensor component and panel used for the production thereof

Method of producing a universal semiconductor housing with precross...

Electronic component comprising a semiconductor chip and a plastic...

Method for producing an electronic component with shielding

Smart card, smart card module, and a method for production of a sma...

Electronic component and panel for producing the same

Plastic package and semiconductor component comprising such a plast...

Semiconductor component with plastic housing, and process for produ...

Biosensor with smart card configuration

Electronic device configured as a multichip module, leadframe and p...

Electronic module having plug contacts and method for producing it

Electronic component with a plastic housing and method for producti...

Electronic device configured as a multichip module, leadframe, pane...

Method for producing channels and cavities in semiconductor housing...

Electronic component with a stack of semiconductor chips and a meth...

Universal package for an electronic component with a semiconductor...

Universal semiconductor housing with precrosslinked plastic embeddi...

Electronic component with at least one semiconductor chip and metho...

Electronic component with at least two stacked semiconductor chips...

Electronic component with at least two stacked semiconductor chips...

Electronic component and process for producing the electronic compo...

Electronic component with at least two stacked semiconductor chips,...

Electronic component with shielding and method for its production