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Robert D. Mikkola

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  • Grafton, MA, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Leveler compounds
    • Patent number 8,506,788
    • Issue date Aug 13, 2013
    • Rohm and Haas Electronic Materials LLC
    • Deyan Wang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Leveler compounds
    • Patent number 8,262,891
    • Issue date Sep 11, 2012
    • Rohm and Haas Electronic Materials LLC
    • Deyan Wang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Leveler compounds
    • Patent number 7,662,981
    • Issue date Feb 16, 2010
    • Rohm and Haas Electronic Materials LLC
    • Deyan Wang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Leveler compounds
    • Patent number 7,510,639
    • Issue date Mar 31, 2009
    • Rohm and Haas Electronic Materials LLC
    • Deyan Wang
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Grant

    Electrode, electrochemical cell, and method for analysis of electro...
    • Patent number 7,144,488
    • Issue date Dec 5, 2006
    • Shipley Company, L.L.C.
    • Robert A. Binstead
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Leveler compounds
    • Patent number 7,128,822
    • Issue date Oct 31, 2006
    • Shipley Company, L.L.C.
    • Deyan Wang
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Seed layer repair
    • Patent number 6,797,146
    • Issue date Sep 28, 2004
    • Shipley Company, L.L.C.
    • Denis Morrissey
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Seed repair and electroplating bath
    • Patent number 6,682,642
    • Issue date Jan 27, 2004
    • Shipley Company, L.L.C.
    • Robert A. Mikkola
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method of electrodepositing copper
    • Patent number 6,679,983
    • Issue date Jan 20, 2004
    • Shipley Company, L.L.C.
    • Denis Morrissey
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Electroplating method
    • Patent number 6,649,038
    • Issue date Nov 18, 2003
    • Shipley Company, L.L.C.
    • Robert D. Mikkola
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    ELECTROPLATING BATH
    • Publication number 20140238868
    • Publication date Aug 28, 2014
    • DOW GLOBAL TECHNOLOGIES LLC
    • Tina C. LI
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    LEVELER COMPOUNDS
    • Publication number 20130001088
    • Publication date Jan 3, 2013
    • Rohm and Haas Electronic Materials L.L.C.
    • Deyan Wang
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Leveler compounds
    • Publication number 20090139873
    • Publication date Jun 4, 2009
    • Rohm and Haas Electronic Materials L.L.C.
    • Deyan Wang
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Leveler compounds
    • Publication number 20070084732
    • Publication date Apr 19, 2007
    • Rohm and Haas Electronic Materials L.L.C.
    • Deyan Wang
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Plating method
    • Publication number 20070012576
    • Publication date Jan 18, 2007
    • Rohm and Haas Electronic Materials L.L.C.
    • Robert A. Binstead
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Leveler compounds
    • Publication number 20060016693
    • Publication date Jan 26, 2006
    • Rohm and Haas Electronic Materials L.L.C.
    • Deyan Wang
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Plating method
    • Publication number 20050020068
    • Publication date Jan 27, 2005
    • Rohm and Haas Electronic Materials, L.L.C.
    • Deyan Wang
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Leveler compounds
    • Publication number 20040249177
    • Publication date Dec 9, 2004
    • Shipley Company, L.L.C.
    • Deyan Wang
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Electroplating composition
    • Publication number 20040222104
    • Publication date Nov 11, 2004
    • Rohm and Haas Electronic Materials, L.L.C.
    • Deyan Wang
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Electroplating bath
    • Publication number 20040217009
    • Publication date Nov 4, 2004
    • Shipley Company, L.L.C.
    • Robert D. Mikkola
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Electrode, electrochemical cell, and method for analysis of electro...
    • Publication number 20040089538
    • Publication date May 13, 2004
    • Shipley Company, L.L.C.
    • Robert A. Binstead
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Electroplating method
    • Publication number 20020074231
    • Publication date Jun 20, 2002
    • Shipley Company, L.L.C.
    • Robert D. Mikkola
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Seed layer repair
    • Publication number 20020053519
    • Publication date May 9, 2002
    • Shipley Company, L.L.C.
    • Denis Morrissey
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Electrolyte
    • Publication number 20020043467
    • Publication date Apr 18, 2002
    • Shipley Company, L.L.C.
    • Denis Morrissey
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Seed repair and electroplating bath
    • Publication number 20020043468
    • Publication date Apr 18, 2002
    • Shipley Company, L.L.C.
    • Robert D. Mikkola
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR