Robert D. Topa

Person

Binghamton, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Arrangement and method for degassing small-high aspect ratio drille...
- Patent number 6,626,196
- Issue date Sep 30, 2003
- International Busines Machines Corporation
- Francis J. Downes
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Removal of metal skin from a copper-Invar-copper laminate
- Patent number 6,228,246
- Issue date May 8, 2001
- International Business Machines Corporation
- Madhav Datta
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Biased acid cleaning of a copper-invar-copper laminate
- Patent number 6,179,990
- Issue date Jan 30, 2001
- International Business Machines Corporation
- Raymond Thomas Galasco
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Thermocompression bonding in integrated circuit packaging
- Patent number 5,242,569
- Issue date Sep 7, 1993
- International Business Machines Corporation
- Sung K. Kang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a conductive end portion on a flexible circuit me...
- Patent number 5,237,743
- Issue date Aug 24, 1993
- International Business Machines Corporation
- Raymond A. Busacco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding in integrated circuit packaging
- Patent number 5,148,261
- Issue date Sep 15, 1992
- International Business Machines Corporation
- Sung K. Kang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermocompression bonding in integrated circuit packaging
- Patent number 5,135,155
- Issue date Aug 4, 1992
- International Business Machines Corporation
- Sung K. Kang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead frame plating apparatus for thermocompression bonding
- Patent number 5,120,418
- Issue date Jun 9, 1992
- International Business Machines Corporation
- Sung K. Kang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermocompression bonding in integrated circuit packaging
- Patent number 5,006,917
- Issue date Apr 9, 1991
- International Business Machines Corporation
- Sung K. Kang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for the deposition of palladium-nickel alloy
- Patent number 4,564,426
- Issue date Jan 14, 1986
- International Business Machines Corporation
- Timothy P. Henning
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
Arrangement and method for degassing small-high aspect ratio drille...
- Publication number 20020189637
- Publication date Dec 19, 2002
- International Business Machines
- Francis J. Downes
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Robert D. Topa

Person

Patents Grantslast 30 patents

Arrangement and method for degassing small-high aspect ratio drille...

Removal of metal skin from a copper-Invar-copper laminate

Biased acid cleaning of a copper-invar-copper laminate

Thermocompression bonding in integrated circuit packaging

Method of forming a conductive end portion on a flexible circuit me...

Thermocompression bonding in integrated circuit packaging

Thermocompression bonding in integrated circuit packaging

Lead frame plating apparatus for thermocompression bonding

Thermocompression bonding in integrated circuit packaging

Process for the deposition of palladium-nickel alloy

Patents Applicationslast 30 patents

Arrangement and method for degassing small-high aspect ratio drille...