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Robert Daniel Orr
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Allen, TX, US
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last 30 patents
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Patent Grant
Data structures for semiconductor die packaging
Patent number
10,658,211
Issue date
May 19, 2020
Texas Instruments Incorporated
Joseph Anthony Boduch
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Data structures for semiconductor die packaging
Patent number
10,068,786
Issue date
Sep 4, 2018
Texas Instruments Incorporated
Joseph Anthony Boduch
G01 - MEASURING TESTING
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last 30 patents
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Patent Application
Data Structures for Semiconductor Die Packaging
Publication number
20180350645
Publication date
Dec 6, 2018
TEXAS INSTRUMENTS INCORPORATED
Joseph Anthony Boduch
G01 - MEASURING TESTING