Robert Drexler

Follow

Person

Kirchdorf, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Method for removing material from a semiconductor wafer
- Patent number 7,108,583
- Issue date Sep 19, 2006
- Siltronic AG
- Alexander Heilmaier
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer holder and method of producing a semiconductor wafer
- Patent number 6,117,776
- Issue date Sep 12, 2000
- Wacker Siltronic Gesellschaft fur Halbleitermaterialien AG
- Anton Huber
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR REMOVING MATERIAL FROM A SEMICONDUCTOR WAFER
- Publication number 20060211338
- Publication date Sep 21, 2006
- Silitronic AG
- Alexander Heilmaier
- B24 - GRINDING POLISHING