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Robert E. Ruane
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Endicott, NY, US
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last 30 patents
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Patent Grant
Process for providing a landless via connection
Patent number
5,495,665
Issue date
Mar 5, 1996
International Business Machines Corporation
Richard W. Carpenter
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for forming electrical interconnections in laminated vias
Patent number
5,316,803
Issue date
May 31, 1994
International Business Machines Corporation
Russell T. White
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Encapsulated circuitized power core alignment and lamination
Patent number
5,229,550
Issue date
Jul 20, 1993
International Business Machines Corporation
Perminder S. Bindra
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Encapsulated circuitized power core alignment and lamination
Patent number
5,129,142
Issue date
Jul 14, 1992
International Business Machines Corporation
Perminder S. Bindra
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Processing of cores for circuit boards or cards
Patent number
4,918,812
Issue date
Apr 24, 1990
International Business Machines Corporation
Robert E. Ruane
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR