Robert E. Steere III

Person

Boonton, NJ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for polishing the edge of a bonded wafer
- Patent number 6,641,464
- Issue date Nov 4, 2003
- Accretech USA, Inc.
- Robert E. Steere
- B24 - GRINDING POLISHING
Information Patent Grant
Machine for grinding-polishing of a water edge
- Patent number 6,629,875
- Issue date Oct 7, 2003
- Accretech USA, Inc.
- Robert E. Steere
- B24 - GRINDING POLISHING
Information Patent Grant
Method for measuring wafer thickness
- Patent number 6,473,987
- Issue date Nov 5, 2002
- Accretech USA, Inc.
- Robert E. Steere
- G01 - MEASURING TESTING
Information Patent Grant
Wafer notch polishing machine and method of polishing an orientatio...
- Patent number 6,306,016
- Issue date Oct 23, 2001
- TSK America, Inc.
- Robert E. Steere
- B24 - GRINDING POLISHING
Information Patent Grant
Blade track control system
- Patent number 5,351,444
- Issue date Oct 4, 1994
- Silicon Technology Corporation
- Robert E. Steere
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Seal assembly for a wafer grinding machine
- Patent number 5,331,772
- Issue date Jul 26, 1994
- Silicon Technology Corp.
- Robert E. Steere
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer slicing and grinding machine and a method of slicing and grin...
- Patent number 5,329,733
- Issue date Jul 19, 1994
- Silicon Technology Corporation
- Robert E. Steere
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Tool mounting arrangement
- Patent number 5,319,886
- Issue date Jun 14, 1994
- Silicon Technology Corporation
- Robert E. Steere
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer slicing and grinding machine and a method of slicing and grin...
- Patent number 5,189,843
- Issue date Mar 2, 1993
- Silicon Technology Corporation
- Robert E. Steere
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Wafer slicing and grinding system
- Patent number 5,185,956
- Issue date Feb 16, 1993
- Silicon Technology Corporation
- Robert E. Steere
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Mounting for an internal diameter saw blade
- Patent number 5,148,797
- Issue date Sep 22, 1992
- Silicon Technology Corporation
- Robert E. Steere
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Slicing and grinding system for a wafer slicing machine
- Patent number 5,111,622
- Issue date May 12, 1992
- Silicon Technology Corporation
- Robert E. Steere
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Flat grind stage assembly for an automatic edge grinder
- Patent number 5,076,021
- Issue date Dec 31, 1991
- Silicon Technology Corporation
- Robert E. Steere
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer centering assembly
- Patent number 5,058,328
- Issue date Oct 22, 1991
- Silicon Technology Corporation
- Robert E. Steere
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Notch grinder
- Patent number 5,036,624
- Issue date Aug 6, 1991
- Silicon Technology Corporation
- Robert E. Steere
- B24 - GRINDING POLISHING
Information Patent Grant
Seal assembly for a wafer grinding machine
- Patent number 5,036,628
- Issue date Aug 6, 1991
- Silicon Technology Corporation
- Robert E. Steere
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer alignment fixture
- Patent number 4,970,772
- Issue date Nov 20, 1990
- Sulzer Brothers Limited
- Robert E. Steere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Blade mount for inner diameter saw blade
- Patent number 4,716,881
- Issue date Jan 5, 1988
- Silicon Technology Corporation
- Robert E. Steere
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Automatic edge grinder
- Patent number 4,638,601
- Issue date Jan 27, 1987
- Silicon Technology Corporation
- Robert Steere
- B24 - GRINDING POLISHING
Information Patent Grant
Balanced rotary saw assembly and a method of balancing the same
- Patent number 4,537,177
- Issue date Aug 27, 1985
- Silicon Technology
- Robert E. Steere
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Precision tensioning device for ID saw blade
- Patent number 4,498,449
- Issue date Feb 12, 1985
- Silicon Technology Corporation
- George S. Kachajian
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafering system
- Patent number 4,420,909
- Issue date Dec 20, 1983
- Silicon Technology Corporation
- Robert E. Steere
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Fluid metering valve
- Patent number 4,171,006
- Issue date Oct 16, 1979
- Silicon Technology Corporation
- Robert E. Steere
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Hydraulic blade mount
- Patent number 4,014,311
- Issue date Mar 29, 1977
- Silicon Technology Corporation
- Robert E. Steere
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Wafer processing machine
- Publication number 20010011002
- Publication date Aug 2, 2001
- Robert E. Steere
- B24 - GRINDING POLISHING

Robert E. Steere III

Person

Patents Grantslast 30 patents

Method and apparatus for polishing the edge of a bonded wafer

Machine for grinding-polishing of a water edge

Method for measuring wafer thickness

Wafer notch polishing machine and method of polishing an orientatio...

Blade track control system

Seal assembly for a wafer grinding machine

Wafer slicing and grinding machine and a method of slicing and grin...

Tool mounting arrangement

Wafer slicing and grinding machine and a method of slicing and grin...

Wafer slicing and grinding system

Mounting for an internal diameter saw blade

Slicing and grinding system for a wafer slicing machine

Flat grind stage assembly for an automatic edge grinder

Wafer centering assembly

Notch grinder

Seal assembly for a wafer grinding machine

Wafer alignment fixture

Blade mount for inner diameter saw blade

Automatic edge grinder

Balanced rotary saw assembly and a method of balancing the same

Precision tensioning device for ID saw blade

Wafering system

Fluid metering valve

Hydraulic blade mount

Patents Applicationslast 30 patents

Wafer processing machine