Robert F Cheney

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Chandler, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package lids with polymer features
- Patent number 11,935,799
- Issue date Mar 19, 2024
- Intel Corporation
- Elah Bozorg-Grayeli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an electrical device and electrical devices
- Patent number 10,269,695
- Issue date Apr 23, 2019
- Intel Corporation
- Robert F Cheney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an electrical device and electrical devices
- Patent number 9,691,675
- Issue date Jun 27, 2017
- Intel Corporation
- Robert F Cheney
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE LIDS WITH POLYMER FEATURES
- Publication number 20200411395
- Publication date Dec 31, 2020
- Intel Corporation
- Elah Bozorg-Grayeli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING AN ELECTRICAL DEVICE AND ELECTRICAL DEVICES
- Publication number 20170263517
- Publication date Sep 14, 2017
- Intel Corporation
- Robert F Cheney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING AN ELECTRICAL DEVICE AND ELECTRICAL DEVICES
- Publication number 20170178988
- Publication date Jun 22, 2017
- Intel Corporation
- Robert F Cheney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
On Package Floating Metal/Stiffener Grounding to Mitigate RFI and S...
- Publication number 20160268213
- Publication date Sep 15, 2016
- Intel Corporation
- Hongjin JIANG
- H01 - BASIC ELECTRIC ELEMENTS