Robert F. Kalman

Person

Sunnyvale, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integration of OE devices with ICS
- Patent number 12,174,441
- Issue date Dec 24, 2024
- AvicenaTech, Corp.
- Robert Kalman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED chip-to-chip vertically launched optical communications with op...
- Patent number 12,101,128
- Issue date Sep 24, 2024
- AvicenaTech, Corp.
- Bardia Pezeshki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Hybrid integration of microLED interconnects with ICs
- Patent number 12,101,122
- Issue date Sep 24, 2024
- AVICENATECH CORP.
- Robert Kalman
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Chip-scale optical interconnect using microLEDs
- Patent number 12,074,192
- Issue date Aug 27, 2024
- AvicenaTech, Corp.
- Bardia Pezeshki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced microLEDs for inter-chip communications
- Patent number 12,034,096
- Issue date Jul 9, 2024
- AVICENATECH CORP.
- Bardia Pezeshki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bit-wise inverse multiplexing for optical channels utilizing microLEDs
- Patent number 11,949,455
- Issue date Apr 2, 2024
- Avicena Tech Corp.
- Robert Kalman
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Parallel optical communication channels using microLEDs
- Patent number 11,916,598
- Issue date Feb 27, 2024
- AVICENATECH CORP.
- Robert T. Weverka
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Systems using fan-in and fan-out microLED-based interconnects
- Patent number 11,914,200
- Issue date Feb 27, 2024
- AVICENATECH CORP.
- Bardia Pezeshki
- G02 - OPTICS
Information Patent Grant
Embedding LEDs with waveguides
- Patent number 11,906,779
- Issue date Feb 20, 2024
- AVICENATECH CORP.
- Robert Kalman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging for microLEDs for chip to chip communication
- Patent number 11,835,758
- Issue date Dec 5, 2023
- AVICENATECH CORP.
- Bardia Pezeshki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect networks using microLED-based optical links
- Patent number 11,824,590
- Issue date Nov 21, 2023
- AVICENATECH CORP.
- Robert Kalman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-array parallel optical links
- Patent number 11,822,135
- Issue date Nov 21, 2023
- Avicena Tech Corp.
- Robert Kalman
- G02 - OPTICS
Information Patent Grant
Integration of OE devices with ICs
- Patent number 11,822,138
- Issue date Nov 21, 2023
- AVICENATECH CORP.
- Robert Kalman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer planar waveguide interconnects
- Patent number 11,815,712
- Issue date Nov 14, 2023
- AVICENATECH CORP.
- Robert Kalman
- G02 - OPTICS
Information Patent Grant
High speed and multi-contact LEDs for data communication
- Patent number 11,791,896
- Issue date Oct 17, 2023
- AVICENATECH CORP.
- Bardia Pezeshki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coherent fiber bundle parallel optical links
- Patent number 11,791,901
- Issue date Oct 17, 2023
- AVICENATECH CORP.
- Robert Kalman
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
LED chip-to-chip vertically launched optical communications with op...
- Patent number 11,764,878
- Issue date Sep 19, 2023
- AVICENATECH CORP.
- Bardia Pezeshki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Optically-enhanced multichip packaging
- Patent number 11,728,894
- Issue date Aug 15, 2023
- AVICENATECH CORP.
- Robert Kalman
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Hybrid integration of microLED interconnects with ICs
- Patent number 11,677,472
- Issue date Jun 13, 2023
- AVICENATECH CORP.
- Robert Kalman
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Optical interconnects using microLEDs
- Patent number 11,624,882
- Issue date Apr 11, 2023
- AVICENATECH CORP.
- Bardia Pezeshki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedding LEDs with waveguides
- Patent number 11,619,781
- Issue date Apr 4, 2023
- AVICENATECH CORP.
- Robert Kalman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED array for in-plane optical interconnects
- Patent number 11,605,618
- Issue date Mar 14, 2023
- AVICENATECH CORP.
- Michael Krames
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-scale optical interconnect using microLEDs
- Patent number 11,515,356
- Issue date Nov 29, 2022
- AVICENATECH CORP.
- Bardia Pezeshki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging for microLEDs for chip to chip communication
- Patent number 11,513,285
- Issue date Nov 29, 2022
- AVICENATECH CORP.
- Bardia Pezeshki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical transceiver design for short distance communication systems...
- Patent number 11,483,182
- Issue date Oct 25, 2022
- AVICENATECH CORP.
- Bardia Pezeshki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Coherent fiber bundle parallel optical links
- Patent number 11,476,942
- Issue date Oct 18, 2022
- AVICENATECH CORP.
- Robert Kalman
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
High speed and multi-contact LEDs for data communication
- Patent number 11,418,257
- Issue date Aug 16, 2022
- AVICENATECH CORP.
- Bardia Pezeshki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Large signal three-level superfluorescent fiber sources
- Patent number 5,185,749
- Issue date Feb 9, 1993
- The Board of Trustee of the Leland Stanford Junior University
- Robert F. Kalman
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
ENHANCED MICRO-OPTICAL STRUCTURES FOR PARALLEL MICROLED LINKS
- Publication number 20240385394
- Publication date Nov 21, 2024
- Rowan Pocock
- G02 - OPTICS
Information Patent Application
OPTICALLY INTERCONNECTED HIGH BANDWIDTH MEMORY ARCHITECTURES
- Publication number 20240345344
- Publication date Oct 17, 2024
- Sunghwan Min
- G02 - OPTICS
Information Patent Application
BIT-WISE INVERSE MULTIPLEXING FOR OPTICAL CHANNELS UTILIZING MICROLEDS
- Publication number 20240313862
- Publication date Sep 19, 2024
- AVICENATECH CORP.
- Robert Kalman
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SYSTEMS USING MICROLED-BASED INTERCONNECTS
- Publication number 20240302605
- Publication date Sep 12, 2024
- AVICENATECH CORP.
- Bardia Pezeshki
- G02 - OPTICS
Information Patent Application
COHERENT FIBER BUNDLE PARALLEL OPTICAL LINKS
- Publication number 20240305379
- Publication date Sep 12, 2024
- AVICENATECH CORP.
- Robert Kalman
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
INTERCONNECT NETWORKS USING MICROLED-BASED OPTICAL LINKS
- Publication number 20240235697
- Publication date Jul 11, 2024
- AVICENATECH CORP.
- Robert Kalman
- G02 - OPTICS
Information Patent Application
INTERCONNECT NETWORKS USING MICROLED-BASED OPTICAL LINKS
- Publication number 20240137132
- Publication date Apr 25, 2024
- AVICENATECH CORP.
- Robert Kalman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING FOR MICROLEDS FOR CHIP TO CHIP COMMUNICATION
- Publication number 20240085622
- Publication date Mar 14, 2024
- AVICENATECH CORP.
- Bardia Pezeshki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH SPEED AND MULTI-CONTACT LEDS FOR DATA COMMUNICATION
- Publication number 20240072895
- Publication date Feb 29, 2024
- AVICENATECH CORP.
- Bardia Pezeshki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF OE DEVICES WITH ICS
- Publication number 20240053558
- Publication date Feb 15, 2024
- AVICENATECH CORP.
- Robert Kalman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-ARRAY PARALLEL OPTICAL LINKS
- Publication number 20240045155
- Publication date Feb 8, 2024
- AVICENATECH CORP.
- Robert Kalman
- G02 - OPTICS
Information Patent Application
MULTI-LAYER PLANAR WAVEGUIDE INTERCONNECTS
- Publication number 20240036246
- Publication date Feb 1, 2024
- AVICENATECH CORP.
- Robert Kalman
- G02 - OPTICS
Information Patent Application
COHERENT FIBER BUNDLE PARALLEL OPTICAL LINKS
- Publication number 20240022330
- Publication date Jan 18, 2024
- AVICENATECH CORP.
- Robert Kalman
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
COUPLING MICROLEDS TO OPTICAL COMMUNICATION CHANNELS
- Publication number 20240012215
- Publication date Jan 11, 2024
- AVICENATECH CORP.
- Robert Kalman
- G02 - OPTICS
Information Patent Application
LED CHIP-TO-CHIP VERTICALLY LAUNCHED OPTICAL COMMUNICATIONS WITH OP...
- Publication number 20230412282
- Publication date Dec 21, 2023
- AVICENATECH CORP.
- Bardia Pezeshki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
OPTICALLY-ENHANCED MULTICHIP PACKAGING
- Publication number 20230344518
- Publication date Oct 26, 2023
- AVICENATECH CORP.
- Robert Kalman
- G02 - OPTICS
Information Patent Application
HYBRID INTEGRATION OF MICROLED INTERCONNECTS WITH ICS
- Publication number 20230299854
- Publication date Sep 21, 2023
- AVICENATECH CORP.
- Robert Kalman
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
EMBEDDING LEDS WITH WAVEGUIDES
- Publication number 20230296835
- Publication date Sep 21, 2023
- AVICENATECH CORP.
- Robert Kalman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL INTERCONNECTS USING MICROLEDS
- Publication number 20230280557
- Publication date Sep 7, 2023
- AVICENATECH CORP.
- Bardia Pezeshki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARALLEL MICROLED-BASED FREE SPACE OPTICAL INTERCONNECTS
- Publication number 20230268999
- Publication date Aug 24, 2023
- Robert Kalman
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PACKAGING MICROLED OPTICAL INTERCONNECTS
- Publication number 20230258888
- Publication date Aug 17, 2023
- Sunghwan Min
- G02 - OPTICS
Information Patent Application
LED ARRAY FOR IN-PLANE OPTICAL INTERCONNECTS
- Publication number 20230197695
- Publication date Jun 22, 2023
- AVICENATECH CORP.
- Michael Krames
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING FOR MICROLEDS FOR CHIP TO CHIP COMMUNICATION
- Publication number 20230176281
- Publication date Jun 8, 2023
- AVICENATECH CORP.
- Bardia Pezeshki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEPARATE OPTOELECTRONIC SUBSTRATE
- Publication number 20230129843
- Publication date Apr 27, 2023
- Robert Kalman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VISIBLE LED-BASED FLEX WAVEGUIDE INTERCONNECTS
- Publication number 20230129104
- Publication date Apr 27, 2023
- Bardia Pezeshki
- G02 - OPTICS
Information Patent Application
VISIBLE WAVELENGTH LED-BASED FIBER LINK
- Publication number 20230118326
- Publication date Apr 20, 2023
- Bardia Pezeshki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-SCALE OPTICAL INTERCONNECT USING MICROLEDS
- Publication number 20230091939
- Publication date Mar 23, 2023
- AVICENATECH CORP.
- Bardia Pezeshki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROLED PARALLEL OPTICAL INTERCONNECTS
- Publication number 20230054560
- Publication date Feb 23, 2023
- Robert Kalman
- G02 - OPTICS
Information Patent Application
COHERENT FIBER BUNDLE PARALLEL OPTICAL LINKS
- Publication number 20230020634
- Publication date Jan 19, 2023
- AVICENATECH CORP.
- Robert Kalman
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
BIT-WISE INVERSE MULTIPLEXING FOR OPTICAL CHANNELS UTILIZING MICROLEDS
- Publication number 20220393768
- Publication date Dec 8, 2022
- Robert Kalman
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Robert F. Kalman

Person

Patents Grantslast 30 patents

Integration of OE devices with ICS

LED chip-to-chip vertically launched optical communications with op...

Hybrid integration of microLED interconnects with ICs

Chip-scale optical interconnect using microLEDs

Enhanced microLEDs for inter-chip communications

Bit-wise inverse multiplexing for optical channels utilizing microLEDs

Parallel optical communication channels using microLEDs

Systems using fan-in and fan-out microLED-based interconnects

Embedding LEDs with waveguides

Packaging for microLEDs for chip to chip communication

Interconnect networks using microLED-based optical links

Multi-array parallel optical links

Integration of OE devices with ICs

Multi-layer planar waveguide interconnects

High speed and multi-contact LEDs for data communication

Coherent fiber bundle parallel optical links

LED chip-to-chip vertically launched optical communications with op...

Optically-enhanced multichip packaging

Hybrid integration of microLED interconnects with ICs

Optical interconnects using microLEDs

Embedding LEDs with waveguides

LED array for in-plane optical interconnects

Chip-scale optical interconnect using microLEDs

Packaging for microLEDs for chip to chip communication

Optical transceiver design for short distance communication systems...

Coherent fiber bundle parallel optical links

High speed and multi-contact LEDs for data communication

Large signal three-level superfluorescent fiber sources

Patents Applicationslast 30 patents

ENHANCED MICRO-OPTICAL STRUCTURES FOR PARALLEL MICROLED LINKS

OPTICALLY INTERCONNECTED HIGH BANDWIDTH MEMORY ARCHITECTURES

BIT-WISE INVERSE MULTIPLEXING FOR OPTICAL CHANNELS UTILIZING MICROLEDS

SYSTEMS USING MICROLED-BASED INTERCONNECTS

COHERENT FIBER BUNDLE PARALLEL OPTICAL LINKS

INTERCONNECT NETWORKS USING MICROLED-BASED OPTICAL LINKS

INTERCONNECT NETWORKS USING MICROLED-BASED OPTICAL LINKS

PACKAGING FOR MICROLEDS FOR CHIP TO CHIP COMMUNICATION

HIGH SPEED AND MULTI-CONTACT LEDS FOR DATA COMMUNICATION

INTEGRATION OF OE DEVICES WITH ICS

MULTI-ARRAY PARALLEL OPTICAL LINKS

MULTI-LAYER PLANAR WAVEGUIDE INTERCONNECTS

COHERENT FIBER BUNDLE PARALLEL OPTICAL LINKS

COUPLING MICROLEDS TO OPTICAL COMMUNICATION CHANNELS

LED CHIP-TO-CHIP VERTICALLY LAUNCHED OPTICAL COMMUNICATIONS WITH OP...

OPTICALLY-ENHANCED MULTICHIP PACKAGING

HYBRID INTEGRATION OF MICROLED INTERCONNECTS WITH ICS

EMBEDDING LEDS WITH WAVEGUIDES

OPTICAL INTERCONNECTS USING MICROLEDS

PARALLEL MICROLED-BASED FREE SPACE OPTICAL INTERCONNECTS

PACKAGING MICROLED OPTICAL INTERCONNECTS

LED ARRAY FOR IN-PLANE OPTICAL INTERCONNECTS

PACKAGING FOR MICROLEDS FOR CHIP TO CHIP COMMUNICATION

SEPARATE OPTOELECTRONIC SUBSTRATE

VISIBLE LED-BASED FLEX WAVEGUIDE INTERCONNECTS

VISIBLE WAVELENGTH LED-BASED FIBER LINK

CHIP-SCALE OPTICAL INTERCONNECT USING MICROLEDS

MICROLED PARALLEL OPTICAL INTERCONNECTS

COHERENT FIBER BUNDLE PARALLEL OPTICAL LINKS

BIT-WISE INVERSE MULTIPLEXING FOR OPTICAL CHANNELS UTILIZING MICROLEDS