Robert F. Mortan

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McKinney, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Packaged device having selective lead pullback for dimple depth con...
- Patent number 11,600,557
- Issue date Mar 7, 2023
- Texas Instruments Incorporated
- Robert F. Mortan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced semiconductor package
- Patent number 7,038,311
- Issue date May 2, 2006
- Texas Instruments Incorporated
- Joe D. Woodall
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PACKAGED DEVICE HAVING SELECTIVE LEAD PULLBACK FOR DIMPLE DEPTH CON...
- Publication number 20200066618
- Publication date Feb 27, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Robert F. Mortan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and system for producing resilient solder joints
- Publication number 20050148111
- Publication date Jul 7, 2005
- TEXAS INSTRUMENTS INCORPORATED
- Robert F. Mortan
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Thermally enhanced semiconductor package
- Publication number 20050133906
- Publication date Jun 23, 2005
- Joe D. Woodall
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flex resistant semiconductor die pad, leadframe, and package
- Publication number 20040227216
- Publication date Nov 18, 2004
- Robert F. Mortan
- H01 - BASIC ELECTRIC ELEMENTS