Robert FAUL

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Muenchen, DE

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Patents Grantslast 30 patents

Information Patent Grant
3D flex-foil package
- Patent number 11,764,122
- Issue date Sep 19, 2023
- Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Robert Faul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin dual foil package including multiple foil substrates
- Patent number 11,615,996
- Issue date Mar 28, 2023
- Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Robert Faul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flex-foil package with coplanar topology for high-frequency signals
- Patent number 11,521,919
- Issue date Dec 6, 2022
- Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Robert Faul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a chip package, and chip package
- Patent number 8,563,358
- Issue date Oct 22, 2013
- Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Christof Landesberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
FLEX-FOIL PACKAGE WITH COPLANAR TOPOLOGY FOR HIGH-FREQUENCY SIGNALS
- Publication number 20200279797
- Publication date Sep 3, 2020
- FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG e.V.
- Robert FAUL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D FLEX-FOIL PACKAGE
- Publication number 20200279787
- Publication date Sep 3, 2020
- FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG e.V.
- Robert FAUL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN DUAL FOIL PACKAGE
- Publication number 20200279785
- Publication date Sep 3, 2020
- FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG e.V.
- Robert FAUL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Producing a Chip Package, and Chip Package
- Publication number 20120091594
- Publication date Apr 19, 2012
- Christof LANDESBERGER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR