Robert Fox

Person

Greenfield Center, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
PIC die with optical deflector for ambient light
- Patent number 11,837,547
- Issue date Dec 5, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Roderick Alan Augur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical memory devices
- Patent number 11,367,750
- Issue date Jun 21, 2022
- GLOBALFOUNDRIES U.S. Inc.
- Sunil Kumar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal capacitors including nanofibers
- Patent number 11,038,011
- Issue date Jun 15, 2021
- GLOBALFOUNDRIES U.S. INC.
- Lili Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-density metal-insulator-metal capacitors
- Patent number 10,580,581
- Issue date Mar 3, 2020
- GLOBALFOUNDRIES Inc.
- Robert J. Fox
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects with hybrid metallization
- Patent number 10,236,206
- Issue date Mar 19, 2019
- GLOBALFOUNDRIES Inc.
- Robert J. Fox
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of air gaps with back-end-of-line structures
- Patent number 10,177,029
- Issue date Jan 8, 2019
- GLOBALFOUNDRIES Inc.
- Robert J. Fox
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crack stop with overlapping vias
- Patent number 10,153,232
- Issue date Dec 11, 2018
- GLOBALFOUNDRIES Inc.
- Robert J. Fox
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crack-stop structure for an IC product and methods of making such a...
- Patent number 10,090,258
- Issue date Oct 2, 2018
- GLOBALFOUNDRIES Inc.
- Kevin Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits including a MIMCAP device and methods of formin...
- Patent number 9,583,557
- Issue date Feb 28, 2017
- GLOBALFOUNDRIES, INC.
- Lili Cheng
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
PIC DIE WITH OPTICAL DEFLECTOR FOR AMBIENT LIGHT
- Publication number 20230113261
- Publication date Apr 13, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Roderick Alan Augur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL MEMORY DEVICES
- Publication number 20220271090
- Publication date Aug 25, 2022
- GLOBALFOUNDRIES U.S. Inc.
- Sunil Kumar SINGH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITORS INCLUDING NANOFIBERS
- Publication number 20210126086
- Publication date Apr 29, 2021
- GLOBALFOUNDRIES U.S. Inc.
- Lili Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL MEMORY DEVICES
- Publication number 20200395541
- Publication date Dec 17, 2020
- GLOBALFOUNDRIES INC.
- Sunil Kumar SINGH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-DENSITY METAL-INSULATOR-METAL CAPACITORS
- Publication number 20190148072
- Publication date May 16, 2019
- GLOBALFOUNDRIES INC.
- Robert J. Fox
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTS WITH HYBRID METALLIZATION
- Publication number 20190006234
- Publication date Jan 3, 2019
- GLOBALFOUNDRIES INC.
- Robert J. Fox
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRACK STOP WITH OVERLAPPING VIAS
- Publication number 20180315707
- Publication date Nov 1, 2018
- GLOBALFOUNDRIES INC.
- Robert J. Fox
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS INCLUDING A MIMCAP DEVICE AND METHODS OF FORMIN...
- Publication number 20160064472
- Publication date Mar 3, 2016
- GLOBALFOUNDRIES, Inc.
- Lili Cheng
- G06 - COMPUTING CALCULATING COUNTING

Person

Patents Grantslast 30 patents

PIC die with optical deflector for ambient light

Vertical memory devices

Metal-insulator-metal capacitors including nanofibers

High-density metal-insulator-metal capacitors

Interconnects with hybrid metallization

Integration of air gaps with back-end-of-line structures

Crack stop with overlapping vias

Crack-stop structure for an IC product and methods of making such a...

Integrated circuits including a MIMCAP device and methods of formin...

Patents Applicationslast 30 patents

PIC DIE WITH OPTICAL DEFLECTOR FOR AMBIENT LIGHT

VERTICAL MEMORY DEVICES

METAL-INSULATOR-METAL CAPACITORS INCLUDING NANOFIBERS

VERTICAL MEMORY DEVICES

HIGH-DENSITY METAL-INSULATOR-METAL CAPACITORS

INTERCONNECTS WITH HYBRID METALLIZATION

CRACK STOP WITH OVERLAPPING VIAS

INTEGRATED CIRCUITS INCLUDING A MIMCAP DEVICE AND METHODS OF FORMIN...