Robert H. Bond

Person

Denton, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for holding a strip of conductive lead frames
- Patent number 5,182,851
- Issue date Feb 2, 1993
- SGS-Thomson Microelectronics, Inc.
- Robert H. Bond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal leadframe carrier
- Patent number 5,111,935
- Issue date May 12, 1992
- SGS-Thomson Microelectronics, Inc.
- Robert H. Bond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manipulation and handling of integrated circuit dice
- Patent number 4,915,565
- Issue date Apr 10, 1990
- SGS-Thomson Microelectronics, Inc.
- Robert H. Bond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Uniform leadframe carrier
- Patent number 4,815,595
- Issue date Mar 28, 1989
- SGS-Thomson Microelectronics, Inc.
- Robert H. Bond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip selection in automatic assembly of integrated circuit
- Patent number 4,759,675
- Issue date Jul 26, 1988
- SGS-Thomson Microelectronics, Inc.
- Robert H. Bond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset bending of curvaceously planar radiating leadframe leads in...
- Patent number 4,743,956
- Issue date May 10, 1988
- Thomson Components-Moster Corporation
- Michael A. Olla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated-circuit leadframe adapted for a simultaneous bonding ope...
- Patent number 4,722,060
- Issue date Jan 26, 1988
- Thomson Components-Mostek Corporation
- Daniel J. Quinn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of forming integrated circuits with contact pads in a stand...
- Patent number 4,685,998
- Issue date Aug 11, 1987
- Thomson Components-Mostek Corp.
- Daniel J. Quinn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automatic assembly of integrated circuits
- Patent number 4,627,151
- Issue date Dec 9, 1986
- Thomson Components-Mostek Corporation
- Wayne A. Mulholland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip selection in automatic assembly of integrated circuit
- Patent number 4,627,787
- Issue date Dec 9, 1986
- Thomson Components-Mostek Corporation
- Robert H. Bond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manipulation and handling of integrated circuit dice
- Patent number 4,626,167
- Issue date Dec 2, 1986
- Thomson Components-Mostek Corporation
- Robert H. Bond
- H01 - BASIC ELECTRIC ELEMENTS

Robert H. Bond

Person

Patents Grantslast 30 patents

Method for holding a strip of conductive lead frames

Universal leadframe carrier

Manipulation and handling of integrated circuit dice

Uniform leadframe carrier

Chip selection in automatic assembly of integrated circuit

Offset bending of curvaceously planar radiating leadframe leads in...

Integrated-circuit leadframe adapted for a simultaneous bonding ope...

Process of forming integrated circuits with contact pads in a stand...

Automatic assembly of integrated circuits

Chip selection in automatic assembly of integrated circuit

Manipulation and handling of integrated circuit dice