Robert HANNON

Person

Wappingers Falls, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Implant after through-silicon via (TSV) etch to getter mobile ions
- Patent number 10,170,337
- Issue date Jan 1, 2019
- International Business Machines Corporation
- Christopher Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional integrated circuit integration using dielectric b...
- Patent number 9,406,561
- Issue date Aug 2, 2016
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Computer readable medium encoded with a program for fabricating 3D...
- Patent number 8,962,448
- Issue date Feb 24, 2015
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for forming a deep trench capacitor
- Patent number 8,921,198
- Issue date Dec 30, 2014
- International Business Machines Corporation
- Roger A. Booth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Front side wafer ID processing
- Patent number 8,822,141
- Issue date Sep 2, 2014
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integrated circuit device fabrication with precisely controllabl...
- Patent number 8,738,167
- Issue date May 27, 2014
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-contamination-free through-substrate via structure
- Patent number 8,679,971
- Issue date Mar 25, 2014
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating 3D integrated circuit device using interface...
- Patent number 8,664,081
- Issue date Mar 4, 2014
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optimized annular copper TSV
- Patent number 8,658,535
- Issue date Feb 25, 2014
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integrated circuit device fabrication with precisely controllabl...
- Patent number 8,629,553
- Issue date Jan 14, 2014
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment marks to enable 3D integration
- Patent number 8,546,961
- Issue date Oct 1, 2013
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-contamination-free through-substrate via structure
- Patent number 8,492,878
- Issue date Jul 23, 2013
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integrated circuit device having lower-cost active circuitry lay...
- Patent number 8,492,869
- Issue date Jul 23, 2013
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optimized annular copper TSV
- Patent number 8,487,425
- Issue date Jul 16, 2013
- International Business Machines Corporation
- Paul S Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D multiple die stacking
- Patent number 8,455,270
- Issue date Jun 4, 2013
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a 3D integrated circuit device having lower-...
- Patent number 8,399,336
- Issue date Mar 19, 2013
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods of forming pre fabricated deep trench capaci...
- Patent number 8,372,725
- Issue date Feb 12, 2013
- International Business Machines Corporation
- Robert Hannon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integrated circuit device fabrication using interface wafer as p...
- Patent number 8,298,914
- Issue date Oct 30, 2012
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integrated circuit device fabrication with precisely controllabl...
- Patent number 8,129,256
- Issue date Mar 6, 2012
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for inhibiting back end of line damage from dicing and ch...
- Patent number 8,076,756
- Issue date Dec 13, 2011
- International Business Machines Corporation
- Michael W. Lane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underbump metallurgy for enhanced electromigration resistance
- Patent number 8,022,543
- Issue date Sep 20, 2011
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using crack arrestor for inhibiting damage from dicing and chip pac...
- Patent number 7,955,955
- Issue date Jun 7, 2011
- International Business Machines Corporation
- Michael W. Lane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure to reduce cracking in flip chip underfill
- Patent number 7,919,356
- Issue date Apr 5, 2011
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inhibition of metal diffusion arising from laser dicing
- Patent number 7,674,690
- Issue date Mar 9, 2010
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of inhibition of metal diffusion arising from laser dicing
- Patent number 7,566,637
- Issue date Jul 28, 2009
- International Business Machines Corporation
- Mukta G Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for eliminating aluminum terminal pad material...
- Patent number 7,375,021
- Issue date May 20, 2008
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench body SOI contacts with epitaxial layer formation
- Patent number 6,670,675
- Issue date Dec 30, 2003
- International Business Machines Corporation
- Herbert L. Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming dislocation filter in merged SOI and non-SOI chips
- Patent number 6,486,043
- Issue date Nov 26, 2002
- International Business Machines Corporation
- Robert Hannon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including dislocation in merged SOI/DRAM chips
- Patent number 6,353,246
- Issue date Mar 5, 2002
- International Business Machines Corporation
- Robert Hannon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for the controlling of certain second phases in aluminum nit...
- Patent number 6,306,528
- Issue date Oct 23, 2001
- International Business Machines Corporation
- Richard A. Bates
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Patents Applicationslast 30 patents

Information Patent Application
IMPLANT AFTER THROUGH-SILICON VIA (TSV) ETCH TO GETTER MOBILE IONS
- Publication number 20170200620
- Publication date Jul 13, 2017
- International Business Machines Corporation
- Christopher Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPUTER READABLE MEDIUM ENCODED WITH A PROGRAM FOR FABRICATING 3D...
- Publication number 20150024548
- Publication date Jan 22, 2015
- International Business Machines Corporation
- Mukta G. FAROOQ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT SIDE WAFER ID PROCESSING
- Publication number 20140256130
- Publication date Sep 11, 2014
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTIMIZED ANNULAR COPPER TSV
- Publication number 20130244420
- Publication date Sep 19, 2013
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPUTER READABLE MEDIUM ENCODED WITH A PROGRAM FOR FABRICATING A...
- Publication number 20130189813
- Publication date Jul 25, 2013
- International Business Machines Corporation
- Mukta G. FAROOQ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-CONTAMINATION-FREE THROUGH-SUBSTRATE VIA STRUCTURE
- Publication number 20130143400
- Publication date Jun 6, 2013
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTIMIZED ANNULAR COPPER TSV
- Publication number 20120326309
- Publication date Dec 27, 2012
- International Business Machines Corporation
- PAUL S ANDRY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING 3D INTEGRATED CIRCUIT DEVICE USING INTERFACE...
- Publication number 20120309127
- Publication date Dec 6, 2012
- International Business Machines Corporation
- Mukta G. FAROOQ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTEGRATED CIRCUIT DEVICE HAVING LOWER-COST ACTIVE CIRCUITRY LAY...
- Publication number 20120299200
- Publication date Nov 29, 2012
- International Business Machines Corporation
- Mukta G. FAROOQ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TUNING THE TRHESHOLD VOLTAGE OF A METAL GATE AND HIGH-K...
- Publication number 20120181661
- Publication date Jul 19, 2012
- International Business Machines Corporation
- Roger A. Booth, JR.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIGNMENT MARKS TO ENABLE 3D INTEGRATION
- Publication number 20120175789
- Publication date Jul 12, 2012
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTEGRATED CIRCUIT DEVICE FABRICATION WITH PRECISELY CONTROLLABL...
- Publication number 20120153429
- Publication date Jun 21, 2012
- International Business Machines Corporation
- Mukta G. FAROOQ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTEGRATED CIRCUIT DEVICE FABRICATION WITH PRECISELY CONTROLLABL...
- Publication number 20120149173
- Publication date Jun 14, 2012
- International Business Machines Corporation
- Mukta G. FAROOQ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-CONTAMINATION-FREE THROUGH-SUBSTRATE VIA STRUCTURE
- Publication number 20120018851
- Publication date Jan 26, 2012
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS OF FORMING PRE FABRICATED DEEP TRENCH CAPACI...
- Publication number 20110204524
- Publication date Aug 25, 2011
- International Business Machines Corporation
- Robert HANNON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR INHIBITING BACK END OF LINE DAMAGE FROM DICING AND CH...
- Publication number 20110140245
- Publication date Jun 16, 2011
- International Business Machines Corporation
- Michael W. Lane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D MULTIPLE DIE STACKING
- Publication number 20110065214
- Publication date Mar 17, 2011
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTEGRATED CIRCUIT DEVICE HAVING LOWER-COST ACTIVE CIRCUITRY LAY...
- Publication number 20100314711
- Publication date Dec 16, 2010
- International Business Machines Corporation
- Mukta G. FAROOQ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL INTEGRATED CIRCUIT INTEGRATION USING DIELECTRIC B...
- Publication number 20100264551
- Publication date Oct 21, 2010
- International Business Machines Corporation
- MUKTA G. FAROOQ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TUNING THE THRESHOLD VOLTAGE OF A METAL GATE AND HIGH-K...
- Publication number 20100200949
- Publication date Aug 12, 2010
- International Business Machines Corporation
- Roger A. Booth, JR.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTEGRATED CIRCUIT DEVICE FABRICATION USING INTERFACE WAFER AS P...
- Publication number 20100047964
- Publication date Feb 25, 2010
- International Business Machines Corporation
- Mukta G. FAROOQ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTEGRATED CIRCUIT DEVICE FABRICATION WITH PRECISELY CONTROLLABL...
- Publication number 20100044826
- Publication date Feb 25, 2010
- International Business Machines Corporation
- Mukta G. FAROOQ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERBUMP METALLURGY FOR ENHANCED ELECTROMIGRATION RESISTANCE
- Publication number 20090243098
- Publication date Oct 1, 2009
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INHIBITION OF METAL DIFFUSION ARISING FROM LASER DICING
- Publication number 20090155983
- Publication date Jun 18, 2009
- International Business Machines Corporation
- MUKTA G. FAROOQ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Inhibition of Metal Diffusion Arising from Laser Dicing
- Publication number 20090155985
- Publication date Jun 18, 2009
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE TO REDUCE CRACKING IN FLIP CHIP UNDERFILL
- Publication number 20090032974
- Publication date Feb 5, 2009
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INHIBITING DAMAGE FROM DICING AND CHIP PACKAGING INTERACTION FAILU...
- Publication number 20080277765
- Publication date Nov 13, 2008
- International Business Machines Corporation
- Michael W. Lane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP LOCATION IDENTIFICATION
- Publication number 20080057677
- Publication date Mar 6, 2008
- International Business Machines Corporation
- Sylvie Charles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING ALUMINUM-FREE WIRE BOND PAD AND PAD SO FORMED
- Publication number 20080038913
- Publication date Feb 14, 2008
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA STACK STRUCTURES
- Publication number 20080029898
- Publication date Feb 7, 2008
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS

Robert HANNON

Person

Patents Grantslast 30 patents

Implant after through-silicon via (TSV) etch to getter mobile ions

Three dimensional integrated circuit integration using dielectric b...

Computer readable medium encoded with a program for fabricating 3D...

Method and structure for forming a deep trench capacitor

Front side wafer ID processing

3D integrated circuit device fabrication with precisely controllabl...

Metal-contamination-free through-substrate via structure

Method for fabricating 3D integrated circuit device using interface...

Optimized annular copper TSV

3D integrated circuit device fabrication with precisely controllabl...

Alignment marks to enable 3D integration

Metal-contamination-free through-substrate via structure

3D integrated circuit device having lower-cost active circuitry lay...

Optimized annular copper TSV

3D multiple die stacking

Method for fabricating a 3D integrated circuit device having lower-...

Structures and methods of forming pre fabricated deep trench capaci...

3D integrated circuit device fabrication using interface wafer as p...

3D integrated circuit device fabrication with precisely controllabl...

Structure for inhibiting back end of line damage from dicing and ch...

Underbump metallurgy for enhanced electromigration resistance

Using crack arrestor for inhibiting damage from dicing and chip pac...

Method and structure to reduce cracking in flip chip underfill

Inhibition of metal diffusion arising from laser dicing

Method of inhibition of metal diffusion arising from laser dicing

Method and structure for eliminating aluminum terminal pad material...

Deep trench body SOI contacts with epitaxial layer formation

Method of forming dislocation filter in merged SOI and non-SOI chips

Semiconductor device including dislocation in merged SOI/DRAM chips

Method for the controlling of certain second phases in aluminum nit...

Patents Applicationslast 30 patents

IMPLANT AFTER THROUGH-SILICON VIA (TSV) ETCH TO GETTER MOBILE IONS

COMPUTER READABLE MEDIUM ENCODED WITH A PROGRAM FOR FABRICATING 3D...

FRONT SIDE WAFER ID PROCESSING

OPTIMIZED ANNULAR COPPER TSV

COMPUTER READABLE MEDIUM ENCODED WITH A PROGRAM FOR FABRICATING A...

METAL-CONTAMINATION-FREE THROUGH-SUBSTRATE VIA STRUCTURE

OPTIMIZED ANNULAR COPPER TSV

METHOD FOR FABRICATING 3D INTEGRATED CIRCUIT DEVICE USING INTERFACE...

3D INTEGRATED CIRCUIT DEVICE HAVING LOWER-COST ACTIVE CIRCUITRY LAY...

METHOD FOR TUNING THE TRHESHOLD VOLTAGE OF A METAL GATE AND HIGH-K...

ALIGNMENT MARKS TO ENABLE 3D INTEGRATION

3D INTEGRATED CIRCUIT DEVICE FABRICATION WITH PRECISELY CONTROLLABL...

3D INTEGRATED CIRCUIT DEVICE FABRICATION WITH PRECISELY CONTROLLABL...

METAL-CONTAMINATION-FREE THROUGH-SUBSTRATE VIA STRUCTURE

STRUCTURES AND METHODS OF FORMING PRE FABRICATED DEEP TRENCH CAPACI...

STRUCTURE FOR INHIBITING BACK END OF LINE DAMAGE FROM DICING AND CH...

3D MULTIPLE DIE STACKING

3D INTEGRATED CIRCUIT DEVICE HAVING LOWER-COST ACTIVE CIRCUITRY LAY...

THREE DIMENSIONAL INTEGRATED CIRCUIT INTEGRATION USING DIELECTRIC B...

METHOD FOR TUNING THE THRESHOLD VOLTAGE OF A METAL GATE AND HIGH-K...

3D INTEGRATED CIRCUIT DEVICE FABRICATION USING INTERFACE WAFER AS P...

3D INTEGRATED CIRCUIT DEVICE FABRICATION WITH PRECISELY CONTROLLABL...

UNDERBUMP METALLURGY FOR ENHANCED ELECTROMIGRATION RESISTANCE

INHIBITION OF METAL DIFFUSION ARISING FROM LASER DICING

Inhibition of Metal Diffusion Arising from Laser Dicing

METHOD AND STRUCTURE TO REDUCE CRACKING IN FLIP CHIP UNDERFILL

INHIBITING DAMAGE FROM DICING AND CHIP PACKAGING INTERACTION FAILU...

CHIP LOCATION IDENTIFICATION

METHODS OF FORMING ALUMINUM-FREE WIRE BOND PAD AND PAD SO FORMED

VIA STACK STRUCTURES