ROBERT HENRY BOND

Person

PLANO, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated leadframe and bezel structure and device formed from same
- Patent number 9,235,747
- Issue date Jan 12, 2016
- Apple Inc.
- Robert Bond
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic device including finger sensor and related methods
- Patent number 8,836,478
- Issue date Sep 16, 2014
- Authentec, Inc.
- Robert H. Bond
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Finger sensor including capacitive lens and associated methods
- Patent number 8,803,258
- Issue date Aug 12, 2014
- Authentec, Inc.
- Giovanni Gozzini
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrally molded die and bezel structure for fingerprint sensors a...
- Patent number 8,772,884
- Issue date Jul 8, 2014
- Apple Inc.
- Robert Henry Bond
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Pseudo-translucent integrated circuit package
- Patent number 8,582,837
- Issue date Nov 12, 2013
- Authentec, Inc.
- Robert Henry Bond
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Integrally molded die and bezel structure for fingerprint sensors a...
- Patent number 8,569,875
- Issue date Oct 29, 2013
- Authentec, Inc.
- Robert Henry Bond
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Biometric sensor assembly with integrated visual indicator
- Patent number 8,471,345
- Issue date Jun 25, 2013
- Authentec, Inc.
- Robert Henry Bond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrally molded die and bezel structure for fingerprint sensors a...
- Patent number 8,378,508
- Issue date Feb 19, 2013
- Authentec, Inc.
- Robert Henry Bond
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Molded fingerprint sensor structure
- Patent number D652333
- Issue date Jan 17, 2012
- Authentec, Inc.
- Robert Henry Bond
- D10 - Measuring, testing, or signalling instruments
Information Patent Grant
Molded fingerprint sensor structure with indicia regions
- Patent number D652332
- Issue date Jan 17, 2012
- Authentec, Inc.
- Robert Henry Bond
- D10 - Measuring, testing, or signalling instruments
Information Patent Grant
System and method for controlling integrated circuit die height and...
- Patent number 7,456,050
- Issue date Nov 25, 2008
- STMicroelectronics, Inc.
- Harry Michael Siegel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Material transport method
- Patent number 6,889,813
- Issue date May 10, 2005
- Amkor Technology, Inc.
- Harold L. Trammell
- B66 - HOISTING LIFTING HAULING
Information Patent Grant
Surface mountable integrated circuit package with detachable module...
- Patent number 5,994,774
- Issue date Nov 30, 1999
- STMicroelectronics, Inc.
- Harry Michael Siegel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array integrated circuit package with high thermal conduc...
- Patent number 5,991,156
- Issue date Nov 23, 1999
- STMicroelectronics, Inc.
- Robert H. Bond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mounting an integrated circuit to a mounting surface
- Patent number 5,724,728
- Issue date Mar 10, 1998
- SGS-Thomson Microelectronics, Inc.
- Robert H. Bond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array integrated circuit package with high thermal conduc...
- Patent number 5,693,572
- Issue date Dec 2, 1997
- SGS-Thomson Microelectronics, Inc.
- Robert H. Bond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball-grid-array integrated circuit package with solder-connected th...
- Patent number 5,642,261
- Issue date Jun 24, 1997
- SGS-Thomson Microelectronics, Inc.
- Robert H. Bond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array package with detachable module
- Patent number 5,642,265
- Issue date Jun 24, 1997
- SGS-Thomson Microelectronics, Inc.
- Robert H. Bond
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRALLY MOLDED DIE AND BEZEL STRUCTURE FOR FINGERPRINT SENSORS A...
- Publication number 20130320464
- Publication date Dec 5, 2013
- ROBERT HENRY BOND
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRALLY MOLDED DIE AND BEZEL STRUCTURE FOR FINGERPRINT SENSORS A...
- Publication number 20130154031
- Publication date Jun 20, 2013
- Apple Inc.
- ROBERT HENRY BOND
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC DEVICE INCLUDING FINGER SENSOR AND RELATED METHODS
- Publication number 20130076486
- Publication date Mar 28, 2013
- Authentec, Inc.
- Robert H. Bond
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FINGER SENSOR INCLUDING CAPACITIVE LENS AND ASSOCIATED METHODS
- Publication number 20110254108
- Publication date Oct 20, 2011
- Authentec, Inc.
- Giovanni Gozzini
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Biometric Sensor Assembly With Integrated Visual Indicator
- Publication number 20110215341
- Publication date Sep 8, 2011
- UPEK, INC.
- Robert Bond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrally Molded Die And Bezel Structure For Fingerprint Sensors A...
- Publication number 20110215484
- Publication date Sep 8, 2011
- UPEK, INC.
- Robert Bond
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Integrated Leadframe And Bezel Structure And Device Formed From Same
- Publication number 20100127366
- Publication date May 27, 2010
- UPEK, INC.
- Robert Bond
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Pseudo-Translucent Integrated Circuit Package
- Publication number 20090169071
- Publication date Jul 2, 2009
- UPEK, INC.
- Robert Bond
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
System and method for controlling integrated circuit die height and...
- Publication number 20050001330
- Publication date Jan 6, 2005
- STMicroelectronics, Inc.
- Harry Michael Siegel
- H01 - BASIC ELECTRIC ELEMENTS

ROBERT HENRY BOND

Person

Patents Grantslast 30 patents

Integrated leadframe and bezel structure and device formed from same

Electronic device including finger sensor and related methods

Finger sensor including capacitive lens and associated methods

Integrally molded die and bezel structure for fingerprint sensors a...

Pseudo-translucent integrated circuit package

Integrally molded die and bezel structure for fingerprint sensors a...

Biometric sensor assembly with integrated visual indicator

Integrally molded die and bezel structure for fingerprint sensors a...

Molded fingerprint sensor structure

Molded fingerprint sensor structure with indicia regions

System and method for controlling integrated circuit die height and...

Material transport method

Surface mountable integrated circuit package with detachable module...

Ball grid array integrated circuit package with high thermal conduc...

Method of mounting an integrated circuit to a mounting surface

Ball grid array integrated circuit package with high thermal conduc...

Ball-grid-array integrated circuit package with solder-connected th...

Ball grid array package with detachable module

Patents Applicationslast 30 patents

INTEGRALLY MOLDED DIE AND BEZEL STRUCTURE FOR FINGERPRINT SENSORS A...

INTEGRALLY MOLDED DIE AND BEZEL STRUCTURE FOR FINGERPRINT SENSORS A...

ELECTRONIC DEVICE INCLUDING FINGER SENSOR AND RELATED METHODS

FINGER SENSOR INCLUDING CAPACITIVE LENS AND ASSOCIATED METHODS

Biometric Sensor Assembly With Integrated Visual Indicator

Integrally Molded Die And Bezel Structure For Fingerprint Sensors A...

Integrated Leadframe And Bezel Structure And Device Formed From Same

Pseudo-Translucent Integrated Circuit Package

System and method for controlling integrated circuit die height and...